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proteanTecs Announces Silicon-Proven IP on TSMC's Advanced N2P Process

09/25/2025 | BUSINESS WIRE
proteanTecs®, a global leader in advanced analytics for semiconductor health and performance monitoring, announced the successful silicon-proven validation of its innovative IP-based health and performance monitoring technology at TSMC’s industry-leading 2nm (N2P) process node.

Cadence, TSMC Team on AI-Driven Flows and IP for Advanced Nodes, 3DFabric

09/25/2025 | BUSINESS WIRE
Cadence announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced design infrastructure and accelerate time to market, for AI and HPC customer applications.

Siemens Collaborates with TSMC to Accelerate 3D IC and AI-driven Circuit and Systems Design

09/24/2025 | Siemens
At the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital Industries Software announced multiple new collaborations with TSMC, including product certifications and innovative design solutions enablement initiatives for the foundry’s newest and most advanced process technologies.

2Q25 Foundry Revenue Surges 14.6% to Record High, TSMC’s Market Share Hits 70%

09/01/2025 | TrendForce
TrendForce’s latest investigations reveal that global foundry revenue in 2Q25 reached a record US$41.7 billion, up 14.6% QoQ, thanks to China’s consumer subsidy program spurring early stocking, along with upcoming demand for new smartphones, notebooks/PCs, and servers launching in the second half of the year.

TSMC’s Dr. C.C. Wei and Dr. Mark Liu to Receive SIA’s Highest Honor

07/28/2025 | SIA
The Semiconductor Industry Association (SIA) announced Dr. C.C. Wei, TSMC’s Chairman and CEO, and Dr. Mark Liu, TSMC’s Former Chairman and Former President & Co-CEO, have been selected as the 2025 co-recipients of our industry’s highest honor, the Robert N. Noyce Award.
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