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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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IMAPS Enhances IMAPS Academy

08/04/2026 | IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS), the leading organization dedicated to advancing microelectronics and electronics packaging, is pleased to announce the updated IMAPS Academy—an enhanced online training platform designed to address the industry's growing workforce development needs.

IMAPS and DPC: 21 Years of Elevating Technical Knowledge

03/13/2025 | Marcy LaRont, I-Connect007
The IMAPS 21st Device Packaging Conference (DPC) may have taken place at a conference center located down an idyllic desert road showcasing the best of what native Arizona has to offer, but the topics at this conference were anything but laid-back. This important platform for professionals in microelectronics and advanced packaging set the stage for a technology in high demand. Brian Schieman, IMAPS executive director, says the show was organized to demonstrate their commitment to addressing current technological trends and with significant energy directed toward fostering connections within the supply chain.

An Update on USPAE's Strategic Initiatives

11/12/2024 | Marcy LaRont, I-Connect007
James Will became executive director of the U.S. Partnership for Assured Electronics (USPAE) in May and now provides this update on the group's strategic initiatives. The organization, which is affiliated with IPC, recently transitioned to being a 501(c)(3). It is navigating through a dynamic landscape, working to enhance our microelectronics manufacturing capabilities including PCBs, and adapt to emerging technology trends and market challenges.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/29/2024 | Marcy LaRont, PCB007 Magazine
We are well into trade show season and what a season it has been so far! SMTA Dallas, IMAPS, and the SMTA UHDI Symposium have filled out the past two weeks as we barrel toward IPC APEX EXPO in just a week’s time. There have been many exciting announcements of equipment and technology that will be showcased at IPC APEX EXPO, including announcements from Ventec, Blackfox, Insulectro, Indium, and more. Click through the news to see what’s in store for the big show.

The IMAPS Show: A Conversation with John Andresakis

03/26/2024 | Marcy LaRont, PCB007 Magazine
On the last day of the IMAPS Device Packaging Conference, Marcy LaRont sat down with industry veteran John Andresakis of Quantic Ohmega, who attended the conference this week. Not his first time at this event, he talked about the conference, advanced technology, and trying to get the word out about the advanced packaging substrates solution Quantic is offering.
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