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KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA. Attendees are invited to visit KYZEN’s Scott Cain at Booth 703 to explore KYZEN’s innovative MICRONOX® cleaning solutions engineered for today’s most advanced and sensitive semiconductor applications.
With more than 35 years of expertise in high-reliability cleaning processes, KYZEN will showcase three industry-leading cleaning chemistries: MICRONOX MX2127, MX2708 and MX2376. Each formula is engineered to address specific contamination challenges requiring effective cleaning performance while preserving sensitive metals and maintaining process efficiency.
MICRONOX® MX2127 is an aqueous, single-phase chemistry optimized for cleaning lead-free solder flux residues from IGBT modules built on copper and nickel DBC substrates. This chemistry leaves behind immaculate surface conditions, suitable for post-process steps like wire bonding and potting. MX2127 is designed for use in in-line spray-in-air (SIA) cleaning systems and offers an extended bath life, minimizing chemical consumption and improving overall process cost-efficiency.
MICRONOX® MX2708 addresses the cleaning challenges associated with advanced leadless packaging, including Cu pillar flip chips, 2.5D/3D ICs, SiPs, and AiPs. Formulated to penetrate low standoff gaps and clean fine-pitch features, MX2708 effectively removes a wide range of organic acid flux residues at low, safe concentrations. It is non-corrosive to exposed metals and intermetallic alloys and is best suited for spray-in-air cleaning environments.
MICRONOX® MX2376 is a semi-aqueous solvent blend developed to tackle stubborn no-clean and RMA flux residues. Highly effective in ultrasonic immersion cleaning systems, MX2376 is ideal for power electronics such as PMICs, discretes, and power modules. It provides excellent material compatibility on Cu, Ag, and high-Pb alloys while preserving Cu leadframe and Cu DBC surfaces for post-wire bonding and molding processes.
For more than 35 years, KYZEN has developed award-winning cleaning solutions that balance performance, process compatibility, and environmental responsibility. The MICRONOX product line is trusted by semiconductor manufacturers worldwide to deliver consistent cleaning results, even on the most challenging assemblies. Visit KYZEN at Booth 703 to learn how these advanced cleaning chemistries can enhance your production line and improve yield and end-product reliability.
