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NVIDIA Seeks to Raise HBM4 Specs in Response to AMD Competition; SK hynix Expected to Remain Largest Supplier in 2026
September 18, 2025 | TrendForceEstimated reading time: 1 minute
TrendForce reports that NVIDIA has recently pressed key component suppliers of its Vera Rubin server racks to upgrade product specifications, specifically requesting that HBM4 speed per pin be raised to 10 Gbps, as AMD gets set to launch its MI450 Helios platform in 2026. Although whether these upgrades can be achieved remains uncertain, SK hynix is expected to maintain its leading position as the largest supplier in the early mass-production phase of HBM4.
HBM4 is being refined to deliver higher transmission speeds and bandwidth as a critical component for AI servers. The base die plays a decisive role in HBM performance. Among the three leading suppliers, Samsung took an aggressive step in 2024 by upgrading the HBM4 base die process node to FinFET 4nm, targeting volume production by the end of the year. Transmission speeds are projected to reach 10 Gbps, and its production share of products enabling 10Gbps is expected to surpass those of SK hynix and Micron.
TrendForce notes that beyond attempting to raise HBM4 specs, NVIDIA’s primary focus remains on supply availability. If volumes are insufficient—or if new specifications drive up power consumption or costs excessively—NVIDIA may abandon the upgrade or segment its platform products by assigning different component tiers to different suppliers. In addition, NVIDIA may extend second-phase certifications after the initial supplier approval stage, giving other vendors more time to adjust. This strategy will directly impact the production ramp-up speed of the Vera Rubin platform.
Looking at the projected 2026 supplier share of HBM4 for NVIDIA, TrendForce believes that based on established partnerships in 2024–2025, combined with technology maturity, reliability, and capacity scale, SK hynix will remain the dominant supplier next year, while Samsung and Micron shares will depend on the progress and performance of their product qualifications.
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Micron Ships HBM4 to Key Customers to Power Next-Gen AI Platforms
06/11/2025 | MicronThe importance of high-performance memory has never been greater, fueled by its crucial role in supporting the growing demands of AI training and inference workloads in data centers. Micron Technology, Inc., announced the shipment of HBM4 36GB 12-high samples to multiple key customers.
HBM4 Raises the Bar on Manufacturing Complexity, Premium Expected to Exceed 30%
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SK hynix Leads the Market with HBM3e 16hi Products, Boosting Capacity Limits
11/14/2024 | TrendForceSK hynix recently unveiled its development of HBM3e 16hi memory at the SK AI Summit 2024, featuring a 48 GB capacity per cube, with sampling scheduled for the first half of 2025.
JEDEC Approaches Finalization of HBM4 Standard, Eyes Future Innovations
07/15/2024 | JEDECJEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, announced it is nearing completion of the next version of its highly anticipated High Bandwidth Memory (HBM) DRAM standard: HBM4.