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How Does UHDI Improve Routing Capabilities? Listen to Episode 3 Now and Discover
September 24, 2025 | I-Connect007Estimated reading time: Less than a minute

I-Connect007 is excited to announce the release of the latest episode in its ongoing podcast series, On the Line With…, shining a spotlight on one of the most significant emerging innovations in electronics manufacturing: Ultra High Density Interconnect (UHDI).
Episode 3, “How Does Ultra HDI Benefit: Routing Capabilities,” features host Nolan Johnson in conversation with returning guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI technology is transforming design for manufacturability and expanding what’s possible in routing capabilities.
Reflecting on the 12-part series, Nolan Johnson notes, “John paints a clear picture for listeners of how the industry can leverage these innovations to push the boundaries of speed, efficiency, and miniaturization.”
Throughout the series, listeners gain valuable insights, expert perspectives, and real-world examples to deepen their understanding of UHDI and prepare for its expanding role in electronics. Each episode is also accompanied by downloadable educational resources, providing added support for ongoing professional development.
The I-Connect007 On the Line with… American Standard Circuits podcast series is available now on the I-Connect007 platform and major podcast directories.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
On the Line With… Podcast: UHDI and RF Performance
09/22/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra High Density Interconnect (UHDI).
Zuken Announces E3.series 2026 Release for Accelerated Electrical Design and Enhanced Engineering Productivity
09/10/2025 | ZukenZuken reveals details of the upcoming 2026 release of E3.series, which will introduce powerful new features aimed at streamlining electrical and fluid design, enhancing multi-disciplinary collaboration, and boosting engineering productivity.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Zuken Opens New E3.series Development Center
08/29/2025 | ZukenZuken is relocating the E3.series development team to a new, state-of-the-art facility in Neu-Ulm. Effective September 1, 2025, the new headquarters will be located at Meininger Allee 5, 89231 Neu-Ulm, Germany.