Powering the Future: Why Thermal Management Defines the Future of Electronics
Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
SMT Perspectives & Prospects: Artificial Intelligence, Part 7—Data Module 2
Indium Experts to Present on Thermal Interface Materials at IMAPS Microelectronics Symposium
September 24, 2025 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation experts will deliver technical presentations on thermal interface materials (TIMs) at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.
The first presentation, Reflow and Reliability of In-Ag Soldering Thermal Interface Material without Flux for TIM1 and TIM1.5 Applications, will be presented by Senior Research Metallurgist Dr. Jie Geng. The presentation will focus on indium and indium alloys as TIMs for use in thermal management for high-performance computing and AI, specifically examining the influence of the different compositions of In-Ag alloys and reflow conditions on the voiding performance and interfacial intermetallic compounds in soldered joints.
The second presentation, Liquid Metal Paste Dispensing as a Thermal Interface Material for High-Performance Computing Applications, will be presented by Senior Product Development Specialist for Thermal Interface Materials Miloš Lazić. The presentation will explore a new category of liquid metal paste TIMs that combine gallium-based liquid metals with polymeric materials, referred to as polymer-liquid metal hybrids or polymeric liquid metal pastes, which are increasingly critical as electronic devices become smaller, more power-dense, and generate more heat.
The third presentation, Gallium Phase Change Metal Thermal Interface Material, will also be presented by Lazić. This presentation will examine comprehensive testing and results of a novel, patented, gallium-based phase change thermal interface material (PCTIM) that can provide greater thermal conductivity than organic or polymeric PCTIMs.
Lazić is co-chair of the symposium’s thermal materials track. The presentations will take place on Wednesday, October 1, from 9:30 a.m. to 10:55 a.m.
About the Speakers
Lazić is responsible for developing new thermal materials and products, as well as providing solutions for customer challenges and applications. He also develops new testing methods to evaluate power and thermal products. He holds a bachelor’s degree in electrical engineering and a master’s degree in electronics engineering. Lazić is also certified as an energy efficiency engineer and SMT process engineer, and is fluent in English, Serbian, Croatian, and Bosnian.
Dr. Geng joined Indium Corporation in 2017 and has more than 20 years of experience in materials science research and engineering. He holds a doctorate in metallurgy, a master’s degree in materials science, and a bachelor’s degree in materials science and engineering with notable contributions to the development of Indalloy®292 and Durafuse® HR.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Teledyne FLIR Defense Wins $35+ Million Surveillance System Contract for Reconnaissance Vehicles
04/17/2026 | BUSINESS WIRETeledyne Technologies Incorporated announced that Teledyne FLIR Defense has been awarded a contract worth more than $35 million by WB Electronics S.A. (part of the WB Group) to equip reconnaissance vehicles with TacFLIR® 280-HDEP medium range multi-spectral surveillance systems.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS
04/15/2026 | Indium CorporationIndium Corporation Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages.
Carbice Awarded Multi-Million Dollar U.S. Navy Contract for Thermal Assembly Joint Technology
04/14/2026 | PRNewswireCarbice, a U.S.-based manufacturer and supplier of novel multifunctional assembly joint technologies, has been awarded a multi-million dollar contract by the U.S. Navy's Office of Naval Research.
Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.