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Advanced Electronics Packaging Digest

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Combined Revenue of Top Five Global NAND Flash Suppliers Rose by 83.7% QoQ for 1Q26

05/25/2026 | TrendForce
According to TrendForce’s latest survey of the NAND Flash industry, CSPs worldwide experienced an exponential surge in demand for enterprise SSDs in 1Q26 due to the need for high-speed data transmission and the massive data storage capacities required to build out AI server infrastructure.

Innovative Flash Copper Plating Technology

05/21/2026 | Andreas Schatz and Mustafa Özkök, MKS’ Atotech
The continuous push toward higher functionality, miniaturization, and performance in modern electronic devices—such as smartphones, wearables, and advanced computing platforms—has intensified the demand for high-density interconnect (HDI) printed circuit boards. Central to HDI performance is the reliable formation of blind microvias (BMVs), which serve as critical interlayer connections in modified semi-additive processes (mSAP).

FlashPCB Names Matthew Belknap Production Manager as Operations Continue to Ramp

04/21/2026 | FlashPCB
FlashPCB, a leading provider of quick-turn PCB assembly, has promoted Matthew Belknap to Production Manager, following his recent start with the company earlier this year.

FlashPCB Welcomes Adam Broeckert, EIT as Manufacturing Engineer

04/20/2026 | FlashPCB
FlashPCB, a leading provider of quick-turn PCB assembly, is pleased to announce the addition of Adam Broeckert, EIT, as Manufacturing Engineer.

Indium Corporation Announces Strategic Agreement for Domestic Critical Metals Recovery

04/06/2026 | Indium Corporation
Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and electronics assembly, announced that it has executed a long-term offtake framework agreement with Flash Metals USA Inc., a wholly owned subsidiary of Metallium Limited (MTM), for the supply of critical metals recovered using Metallium’s Flash Joule Heating technology.
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