Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Viscom Inc. to Showcase Latest AI-Powered Inspection Solutions at SMTA Mexico 2026

08/27/2026 | Viscom Inc.
Viscom Inc., will present its latest AI-powered inspection solutions at SMTA Mexico 2026, taking place from October 7–8 at the Expo Guadalajara Salón Jalisco.

Two Teams Tie for Top Honors in Bright Electronics Manufacturing Challenge 2026 Round 1

08/25/2026 | SMTA
The Electronics Manufacturing & Assembly Collaborative (EMAC) announced the Round 1 results of the Bright Electronics Manufacturing Challenge 2026, and for the first time in the competition's history, two teams tied for first place.

Bryan Watson of HyRel Technologies Appointed VP Marketing for SMTA Arizona Chapter

08/24/2026 | HyRel Technologies
Brian Watson, Founder and CEO of HyRel Technologies, Peoria, Arizona, has been appointed VP of Marketing for the SMTA Arizona/Sonora Chapter.

NHanced Semiconductors & University of Florida to Present on Advanced Packaging for Photonics at the 2026 SMTAI Conference

08/24/2026 | NHanced Semiconductors
The upcoming SMTA International Conference will feature a paper titled “Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration,” presented by NHanced Semiconductors vice-president Dr. Charles Woychik and Dr. Navid Asadizanjani from the Florida Semiconductor Institute at University of Florida.

SMTA Introduces New Academic Institution Membership

08/21/2026 | SMTA
The SMTA is introducing a new Academic Institution Membership designed to strengthen connections between academic institutions and the electronics manufacturing industry while helping prepare the next generation of industry professionals.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in