Interlink Electronics Awarded FDA SBIR Grant to Advance Electrochemical Sensors for Food Safety and Quality Monitoring
October 3, 2025 | Globe NewswireEstimated reading time: 1 minute
Interlink Electronics, Inc., a global leader in sensor technology and printed electronic solutions, today announced that its Gas and Environmental Solutions division has received a $200,000 SBIR Phase 1 grant from the Food and Drug Administration (FDA). The funding will accelerate the development of advanced electrochemical sensors designed to improve the safety and quality monitoring of post-harvest food products.
Food security is a critical global concern, making it increasingly necessary to monitor and assess the quality of food materials at every stage of the supply chain. Beyond the significant economic impact, ensuring food safety is a public health imperative that governments worldwide are placing at the forefront of their priorities.
“This grant recognizes Interlink’s proven technologies and expertise in developing accurate, low-power, and cost-effective electrochemical gas sensors for critical applications such as food safety,” said Dr. Sreeni Rao, Vice President of Gas and Environmental Sensing at Interlink Electronics. “With FDA support, we can expand our R&D efforts to design novel sensor platforms capable of monitoring a wide range of food quality parameters across the supply chain. This initiative strengthens our leadership in electrochemical sensing and accelerates the delivery of scalable, competitive solutions to meet the global demand for improved food security.”
Steven N. Bronson, Interlink’s CEO and President, added: “This grant underscores our continued success in winning competitive SBIR funding to drive breakthrough innovation. Beyond the technical achievement, the grant highlights how our expertise in electrochemical sensing positions us to expand into large, high-value markets, such as food safety. We see this as another step in broadening our growth opportunities and delivering long-term value for our shareholders.”
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
Elsyca Acquires Hivelix to Strengthen Simulation Platform for Electrochemical Surface Engineering
04/03/2026 | ElsycaElsyca, a global pioneer in computer-aided engineering (CAE) simulation for electrochemical processes and surface finishing, announces the acquisition of Hivelix, a specialist in advanced surface treatment simulation with strong expertise in multiphysics modelling and AI-assisted process optimisation.
Teledyne Acquires DD-Scientific
01/15/2026 | BUSINESS WIRETeledyne Technologies Incorporated announced the acquisition of DD-Scientific Holdings Limited and its subsidiary DD-Scientific Limited. DD-Scientific, founded in 2011 and headquartered in Fareham, United Kingdom, develops and manufactures high-performance gas sensors for critical applications in industries that demand absolute accuracy.
The Knowledge Base: The Impact of Harsh Environments on Residue Tolerance
11/26/2024 | Mike Konrad -- Column: The Knowledge BaseElectronic devices are ubiquitous, performing critical functions in a wide range of applications, from consumer electronics to aerospace, medical devices, automotive systems, and industrial control systems. Many of these devices operate in harsh environments characterized by extremes in temperature, humidity, pollution, and chemical exposure.
AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Penang Expo & Tech Forum
08/30/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Penang Expo & Tech Forum taking place September 25-26 at AC Hotel Penang in Malaysia.
AIM to Highlight H10 Halogen Free Solder Paste at Productronica India
08/21/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming Productronica India taking place September 11-13 at India Exposition Mart Limited (IEML), Greater Noida, Delhi.