PCBA Market Poised to Reach $147.5 Billion by 2035

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Global printed circuit board assembly market is projected to reach $147.5 billion by 2035, at a CAGR of 4.7% during the forecast period 2025-2035

The report provides an in-depth analysis of the global printed circuit board assembly market across five major regions, emphasizing the current market trends, market sizes, recent developments, and forecasts till 2035.

The growth of this market is driven by the increasing demand for consumer electronics and smart devices, rapid expansion of automotive electronics and electric vehicles, growing adoption of IoT and connected devices, accelerating 5G network deployment, rising demand for medical electronics and healthcare devices, and continuous miniaturization trends requiring advanced assembly technologies. Moreover, electric vehicle electronics expansion, development of wearable and flexible electronics, advanced packaging technologies, and AI hardware adoption are expected to support the market's growth.

Asia-Pacific is projected to register the highest growth rate during the forecast period across the overall printed circuit board assembly market. This growth is fueled by the region's established electronics manufacturing ecosystem, continued capacity expansion by leading EMS providers, and increasing domestic demand for electronic devices. The concentration of major contract manufacturers, well-developed supply chains, and favorable labor costs contribute to the region's manufacturing advantages.

Based on assembly type, the mixed technology segment is projected to grow at the highest CAGR during the forecast period of 2025-2035.

The rapid growth of this segment is mainly due to the increasing complexity of electronic designs requiring both surface mount and through-hole components in a single assembly. This growth is driven by expanding automotive electronics applications, rising demand for ruggedized assemblies in industrial environments, and the need for hybrid solutions that combine high-density mounting with mechanical strength. As electronic systems become more sophisticated and demand both high performance and durability, the adoption of mixed technology assemblies is accelerating rapidly, particularly in sectors that prioritize long-term reliability and harsh environment operation.

Based on component type, the active components segment is expected to account for the largest share of the printed circuit board assembly market.

Active components, including microprocessors, semiconductors, and integrated circuits, are fundamental to modern electronic devices and drive the functionality of virtually all electronic systems. As electronic devices become more intelligent and feature-rich, the demand for sophisticated active components continues to grow. Furthermore, the proliferation of AI-enabled devices, 5G infrastructure, and automotive electronics significantly increases the complexity and quantity of active components required per assembly.

Based on application, the automotive segment is projected to register the highest CAGR from 2025 to 2035.

This growth is driven by the rapid transformation of the automotive industry toward electrification, autonomous driving, and connected vehicle technologies. The increasing electronic content per vehicle, driven by advanced driver assistance systems, infotainment systems, and electric powertrain controls, is significantly boosting demand for sophisticated PCB assemblies. Additionally, the global push toward electric vehicles is creating new requirements for high-power electronics, battery management systems, and thermal management solutions.

Based on end-user industry, the electronics manufacturing services (EMS) segment is expected to account for the largest share of the printed circuit board assembly market in 2025.

This dominance is primarily driven by the widespread outsourcing trend among original equipment manufacturers seeking to reduce costs, access specialized expertise, and focus on core competencies. EMS providers offer comprehensive assembly services, advanced manufacturing capabilities, and economies of scale that individual OEMs find difficult to replicate in-house.