Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
GlobalFoundries, Silicon Labs Expand Partnership to Accelerate Wireless Connectivity Solutions and Strengthen U.S. Chip Manufacturing
November 5, 2025 | GlobalFoundriesEstimated reading time: 1 minute
GlobalFoundries (GF), one of the world’s leading semiconductor manufacturers, and Silicon Labs, the leading innovator in low-power wireless, announced the expansion of their strategic partnership to advance the development of next-generation, energy-efficient wireless technologies and scale U.S.-based semiconductor manufacturing.
This collaboration – the first of its kind to introduce this process technology in the United States – aims to accelerate the development and production of high-performance wireless solutions manufactured at GF’s advanced facility in Malta, New York, reinforcing U.S. semiconductor resilience.
As a part of the partnership, Silicon Labs wireless system-on-chips (SoCs) will be manufactured on GF’s new 40nm Ultra Low Power platform, introduced this fall at GF’s Global Technology Summit in Silicon Valley. Based on GF’s silicon proven 40nm platform and enhanced with embedded SuperFlash technology, the 40ULP-ESF3 platform combines ultra-low standby leakage devices, high endurance and integrated analog features, making it ideal for secure, battery-powered IoT edge applications that require always-on functionality, data security and energy-efficiency.
“We’re excited to deepen our strong partnership with GlobalFoundries to accelerate U.S.-based innovation in wireless connectivity,” said Matt Johnson, President and CEO, Silicon Labs. “This collaboration underscores our shared commitment to innovation and U.S. manufacturing leadership – addressing rising demand for our Series 2 products and strengthening global supply chain resilience to deliver competitive, secure and scalable wireless solutions for our customers.”
“Today’s announcement marks a significant milestone in our partnership with Silicon Labs, as we work together to deliver secure, reliable wireless connectivity and power-efficient solutions for the next generation of smart consumer and industrial devices,” said Tim Breen, CEO of GlobalFoundries. “Bringing this differentiated low power technology to our New York fab expands our ability to deliver power-efficient, essential chips and underscores our commitment to secure, onshore semiconductor manufacturing.”
The expanded partnership addresses the growing demand across consumer and industrial IoT applications for advanced wireless connectivity and reflects both companies’ commitment to strengthening U.S. semiconductor leadership and building a more resilient, geographically diverse supply chain.
Development is underway, with production ramping over the next several years.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Keysight Unveils 3GPP AI Simulation Platform to Accelerate AI-enabled 6G Communications
10/01/2025 | BUSINESS WIREKeysight Technologies, Inc. announced the release of WirelessPro 3GPP AI Simulation Platform (WirelessPro), a next-generation software platform designed to meet the evolving needs of wireless communication system engineers.
INVISIO Earns US Coast Guard 10-year Contract for Wireless Boat Crew Communications System
09/29/2025 | INVISIOINVISIO has secured a 10-year Production Other Transaction Agreement (P-OTA) with the US Coast Guard worth up to SEK 930 million. The first SEK 25 million order of INVISIO systems will be delivered in 2025.
Huawei AgenticRAN Redefines the Value of Wireless Networks
09/29/2025 | Huawei Technologies Co. LtdAs global 5G-A commercialization picks up speed, Eric Zhao, Vice President and Chief Marketing Officer of Huawei's Wireless Solution, delivered a speech titled "AgenticRAN: Create Unlimited with Limited".
AiM Future, Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset
09/01/2025 | BUSINESS WIREAiM Future, a leading AI semiconductor design company, has signed a Memorandum of Understanding (MOU) with Franklin Wireless Corp., a global leader in intelligent wireless solutions, to jointly develop a lightweight AI model and a high-efficiency 1 TOPS performance AI SoC chipset.
Driving the New Era of AI and IoT with Powercast's One-Stop Shop for Wireless Power Solutions
08/18/2025 | PRNewswireAs AI and IoT drive explosive growth, Powercast is redefining how industries power critical infrastructure. By eliminating disposable batteries through long-range RF wireless technology, Powercast delivers cost-efficient, scalable, and sustainable energy solutions tailored to meet the demands of our increasingly connected world.