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Nordson Electronics Solutions to Demonstrate Automated Fluid Dispensing and Selective Soldering Systems at productronica 2025
November 6, 2025 | Nordson Electronics SolutionsEstimated reading time: 1 minute
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for printed circuit board assembly and advanced packaging at Productronica 2025, joining their longstanding distribution partners Amtest Group, stand A2.532, and smartTec Gmbh, stand A2.527, as well as in the Future Packaging Hybrid Live Lab, stand B2.261.
A special focus is on the remarkable SELECT® Synchro system, which delivers patent-pending synchronous motion technology to boost selective soldering throughput by 20–40%. Single- and double-sided boards as well as mixed-technology assemblies are easily processed with nonstop conveyance, in a small footprint, for outstanding productivity.
Equipment to be featured in stands A2.532 and A2.537:
- SELECT® Synchro selective soldering system for unmatched throughput with maximum efficiency.
- ASYMTEK Select Coat® SL-1040: High-volume conformal coating with preventive maintenance features, SC-450 PreciseCoat® Jet, and EasyCoat® 6 software.
- ASYMTEK Forte® Series: High-volume dispensing for consumer electronics, PCBs, flexible circuits, MEMs, and electromechanical assemblies.
Another automated dispensing system will be in the Fraunhofer IZM Future Packaging Hybrid Live Lab, in stand B2.261:
- ASYMTEK Vantage® Series: Precision dispensing for miniaturized components, featuring IntelliJet® and Canvas® software. Ideal for advanced semiconductor packaging.
Productronica is the world’s leading trade fair for electronics development and production, to be held in the Trade Fair Center Messe München, in Munich, Germany, November 18-21, 2025.
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Real Time with... productronica 2025: Rehm's Innovations in Green Technology
12/08/2025 | Real Time with...productronicaMarcy LaRont introduces Michael Hanke at the Rehm booth, where they highlight the busy atmosphere and innovative machines. They discuss the new reflow soldering, formic acid integration, and the machine's efficiency. The focus is on green technology, data reporting, and software integration, including AI components.
Incap Acquires Lacon Group, Expands into Defense and Design Services
12/05/2025 | IncapIncap Corporation has signed on 3 December 2025 an agreement to acquire 100% ownership of Lacon Group, a well-established EMS company with advanced ODM capabilities and modern facilities in Germany and Romania.
Koh Young, Fuji America, and Creative Electron Unite to Launch The SMT Future Experience
12/05/2025 | Koh YoungThree of electronics manufacturing's most innovative companies announced the formation of THE SMT FUTURE EXPERIENCE, an independent collaborative venue designed to accelerate innovation and define the future of SMT manufacturing.
Zhen Ding Posts November 2025 Monthly Revenue Report
12/05/2025 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported November 2025 revenue of NT$18,121 million, down 6.73% MoM and down 6.76% YoY.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/05/2025 | Marcy LaRont, I-Connect007It’s been another big week in global business news with positive projections on global economic growth, primarily driven by AI. U.S. labor markets are showing some strain after copious layoff activity, and there’s possibly a slight “correction” in the stock market, with investors apparently concerned about corporate overvaluation. My must-reads are interesting, informative, and important for industry members, particularly in the U.S. These selections range from onshoring high-tech thermal control to the value of training, recognizing interconnect defects, and an important statement from the Global Electronics Association regarding the USMCA.