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The Shaughnessy Report: Zee Plane! Zee Plane!

11/11/2025 | Andy Shaughnessy -- Column: The Shaughnessy Report
Planes aren’t magic, but they are big time-savers. Without planes, designers would have to create thousands of traces to accomplish the same objectives. You can imagine the first time a designer thought about using a sheet of copper, asking, “Hey, why am I killing myself laying out all these traces? Can’t I just use this sheet of copper instead?”

Designers Notebook: Power and Ground Distribution Basics

10/29/2025 | Vern Solberg -- Column: Designer's Notebook
The principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.

Beyond Design: The Fundamental Structure of Spectral Integrity

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Impedance can be characterized in both the time and frequency domains. In the time domain, it influences how electromagnetic energy propagates through interconnects, affecting signal integrity and waveform fidelity. In the frequency domain, AC impedance determines how well the network can suppress noise and deliver clean power at a range of frequencies. AC impedance shapes how power rails respond to transient loads.

Beyond Design: Slaying Signal Integrity Villains

09/17/2025 | Barry Olney -- Column: Beyond Design
High-speed PCB design is a balancing act, where subtle oversights can develop into major signal integrity nightmares. Some culprits lie dormant during early validation, only to reveal themselves later through workflow disruptions and elusive performance bottlenecks. Take crosstalk, for example. What begins as a stray signal coupling between traces can ripple through the design, ultimately destabilizing the power distribution network. Each of these troublemakers operates with signature tactics, but they also have well-known vulnerabilities.

Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI

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Amphenol Printed Circuits will be offering a small but impressive sample of its vast design, manufacturing, and test capabilities in Radio Frequency (RF) printed circuit boards (PCBs) Rigid-Flex/Flex and backplanes at the 2025 IEEE MTT-S International Microwave Symposium exhibition.
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