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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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November 2025 Design007 Magazine: Proper Plane Design
November 10, 2025 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
In this November issue of Design007 Magazine, we’re focusing on power and ground planes, the ones that help your signals get to their final destination in today’s PCBs.
Planes aren’t magic, but they are big time-savers. Without planes, designers would have to create thousands of traces to accomplish the same objectives. While designers might be tempted just to use a sheet of copper, planes are more than simple copper pours. They provide a decisive advantage in that they have extremely low impedance: Since it’s a sheet of copper, the impedance is almost non-existent.
As a result, power planes provide low impedance and stable power to every component on the board, much like a large power bus. Next to a signal layer, a power plane can shield signals and stop crosstalk and noise. They make great heat sinks too.
Ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues. They offer a low-impedance return path, which helps eliminate jitter and reflections.
Power and ground plane design is often a battle of tradeoffs. Selecting the correct copper thickness of power planes is a good example: Thin copper with high currents can cause IR drop, which can lead to timing errors. This can be mitigated by using thicker copper, but this also affects your signal integrity planning, not to mention your fabricator’s workload.
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Brent Fischthal - Koh YoungSuggested Items
Target Condition: An Exploration of Flooding PCB Layers
04/02/2026 | Kelly Dack -- Column: Target ConditionThe concept of flooding PCB layers with copper has been around for so long, you’d think we’d have it mastered. We haven’t. (Oh, and by “we,” I mean design engineers and the software tools we depend on.) Years ago, PCB artwork was created by hand using light tables, with tape applied to Mylar. Signals were slow, traces were relatively wide, and high-current paths were simply “beefed up” with wider copper. Signal integrity wasn’t yet a driving concern. Today, solid return paths are fundamental to robust design. We understand the importance of continuous reference planes for signal integrity and EMI control.
Boeing Projects Strong African Air Travel Demand, Driving Fleet Expansion Through 2044
12/02/2025 | BoeingAfrica’s passenger air traffic will average 6% annual growth through 2044, driven by a young population, growing middle class, rapid urbanization and airport and connectivity investments, Boeing said.
Beyond Design: Micro-ohm Power Delivery Network for AI-driven GPUs
11/18/2025 | Barry Olney -- Column: Beyond DesignThe evolution of modern processors, marked by faster edge transitions, reduced output impedance, and increasingly complex bus architectures, has significantly augmented the demands on PCB infrastructure. These challenges are compounded by AI-driven graphics processing units (GPUs), which require exceptionally high-power delivery at ultra-low operating voltages, placing greater stress on power integrity and layout design.
The Shaughnessy Report: Zee Plane! Zee Plane!
11/11/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportPlanes aren’t magic, but they are big time-savers. Without planes, designers would have to create thousands of traces to accomplish the same objectives. You can imagine the first time a designer thought about using a sheet of copper, asking, “Hey, why am I killing myself laying out all these traces? Can’t I just use this sheet of copper instead?”
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.