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Advanced Electronics Packaging Digest

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EU Clears €659 Million for German Semiconductor Expansion

07/21/2026 | I-Connect007 Editorial Team
The European Commission has approved €659 million in German state aid for four semiconductor manufacturing projects, continuing Europe's broader effort to strengthen regional semiconductor production and reduce dependence on overseas suppliers.

High Density Packaging User Group Announces European Space Agency Membership

11/04/2025 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that the European Space Agency (ESA) has become a member.

High Density Packaging User Group Announces ASKPCB Membership

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High Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.

HyRel Technologies Showcases Summer Intern Success Through Hands-On Innovation

09/16/2025 | HyRel Technologies
HyRel Technologies, a global provider of quick turn semiconductor modification solutions, proudly highlights the accomplishments of its two recent summer interns, Danny Hoang and Nisarg Jadav.

Automation Meets Sustainability

09/08/2025 | Rick Nichols, GreenSource Engineering
GreenSource Engineering (GSE) is proud to have contributed to the first successful reshoring of a PCB facility on a greenfield site in the United States. While we are honored to have played a key role, full credit for this achievement goes to SEL for its vision, commitment, and professionalism.
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