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MacDermid Alpha Electronics Solutions to Feature an Integrated Materials Platform Engineered for Long-Term Reliability at Productronica
November 12, 2025 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes
Every advancement in electronics raises expectations for enhanced performance and environmental stewardship. Meeting these challenges demands materials engineered for reliability and developed to support sustainable manufacturing. Industry momentum across connected devices, high-reliability automotive electronics, and rapidly increasing compute density is elevating the role of materials selection as a core driver of long-term system performance.
At Productronica Europe 2025 (November 18–21 in Munich, Germany), MacDermid Alpha Electronics Solutions will feature proven solutions that demonstrate measurable gains in reliability, process stability, and sustainability through a connected materials approach to soldering, reinforcement, and thermal management.
“Reliability can mean different things for different applications, but it ultimately takes shape at the materials level, where integrity under thermomechanical stress determines how long a system will hold up in use. The best results come from designing in the right level of performance upfront, rather than risking failures in the field. When materials are matched to the actual demands of the application, it supports longer service life, improves first pass yield, and protects total cost of ownership.” said Scott Lewin, Business Development Director.
Featured Technologies
MacDermid Alpha will feature three complementary solutions engineered for long-term performance while supporting sustainable manufacturing. ALPHA® OM-100 SnCX® 07 Solder Paste delivers dependable lead- and silver-free performance with reduced energy requirements and total cost. ALPHA® HiTech® CF31-4026 Edgebond reinforces BGA components in high-temperature applications while maintaining reworkable flexibility for serviceability. Electrolube® LGF200 and LGF400 Liquid Gap Fillers provide stable thermal management and simplified application across a wide operating range.
Together, these solutions reinforce board-level reliability, improve manufacturing efficiency, and align with evolving sustainability expectations. Visitors are invited to stop by Booth A4-349 to learn how these materials can advance their reliability and performance objectives.
Advancing Reliability with Purpose
MacDermid Alpha’s presence at Productronica Europe underscores its ongoing commitment to helping manufacturers meet the highest standards of reliability and sustainability. By combining proven materials with process insight and technical expertise, the company enables electronics that perform with confidence from initial design through dependable operation.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
MacDermid Alpha to Address Silver Price Volatility Solutions at ECTC 2026
05/15/2026 | MacDermid AlphaAs volatile silver prices continue to place pressure on semiconductor packaging costs and supply chain predictability, MacDermid Alpha Electronics Solutions will highlight material strategies that help manufacturers reduce dependence on silver without sacrificing reliability, thermal performance, or manufacturing efficiency.
Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
Rethinking Stackup, Materials, and Tolerances in Modern Designs
05/14/2026 | Kristin Moyer, Global Electronics AssociationThe simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest
05/13/2026 | I-Connect007The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.