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MacDermid Alpha Electronics Solutions to Feature an Integrated Materials Platform Engineered for Long-Term Reliability at Productronica
November 12, 2025 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
Every advancement in electronics raises expectations for enhanced performance and environmental stewardship. Meeting these challenges demands materials engineered for reliability and developed to support sustainable manufacturing. Industry momentum across connected devices, high-reliability automotive electronics, and rapidly increasing compute density is elevating the role of materials selection as a core driver of long-term system performance.
At Productronica Europe 2025 (November 18–21 in Munich, Germany), MacDermid Alpha Electronics Solutions will feature proven solutions that demonstrate measurable gains in reliability, process stability, and sustainability through a connected materials approach to soldering, reinforcement, and thermal management.
“Reliability can mean different things for different applications, but it ultimately takes shape at the materials level, where integrity under thermomechanical stress determines how long a system will hold up in use. The best results come from designing in the right level of performance upfront, rather than risking failures in the field. When materials are matched to the actual demands of the application, it supports longer service life, improves first pass yield, and protects total cost of ownership.” said Scott Lewin, Business Development Director.
Featured Technologies
MacDermid Alpha will feature three complementary solutions engineered for long-term performance while supporting sustainable manufacturing. ALPHA® OM-100 SnCX® 07 Solder Paste delivers dependable lead- and silver-free performance with reduced energy requirements and total cost. ALPHA® HiTech® CF31-4026 Edgebond reinforces BGA components in high-temperature applications while maintaining reworkable flexibility for serviceability. Electrolube® LGF200 and LGF400 Liquid Gap Fillers provide stable thermal management and simplified application across a wide operating range.
Together, these solutions reinforce board-level reliability, improve manufacturing efficiency, and align with evolving sustainability expectations. Visitors are invited to stop by Booth A4-349 to learn how these materials can advance their reliability and performance objectives.
Advancing Reliability with Purpose
MacDermid Alpha’s presence at Productronica Europe underscores its ongoing commitment to helping manufacturers meet the highest standards of reliability and sustainability. By combining proven materials with process insight and technical expertise, the company enables electronics that perform with confidence from initial design through dependable operation.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Real Time with... SMTAI 2025: Enhancing Device Reliability With Innovative Materials from MacDermid Alpha Electronics Solutions
11/10/2025 | Real Time with...SMTAIMarcy LaRont speaks with Anna Lifton, MacDermid Alpha Electronics Solutions, who discusses the significance of reliability in devices through advanced materials. Anna highlights MacDermid Alpha's foray into polymer chemistry, showcasing new UV curing materials that address electrochemical reliability and thermal cycling challenges. The conversation also covers the difficulties hardware manufacturers encounter, particularly in thermal management and environmental compatibility.
SEMI Foundation Honors Applied Materials at SEMICON West with 2025 Excellence in Achievement Award for Talent Development
11/04/2025 | SEMIThe SEMI Foundation announced it recognized Applied Materials, Inc. with the Excellence in Achievement Award at SEMICON West 2025 in Phoenix, Arizona, honoring the company’s outstanding leadership and collaboration in building the next generation of semiconductor talent.
On the Line with… Ultra HDI, Episode 8: “Materials, Up and Coming Capabilities,” Now Available
11/05/2025 | I-Connect007I-Connect007 is excited to announce the release of the eighth episode of its 12-part podcast series, On the Line with… American Standard Circuits: Ultra HDI. In this episode, “Materials, Up and Coming Capabilities,” host Nolan Johnson sits down with resident expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to discuss how material selection influences the Ultra HDI (UHDI) manufacturing process.
New Podcast Episode: “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics”
11/05/2025 | I-Connect007I-Connect007 has released of a new episode in its Voices of the Industry podcast series, titled “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics.” Hosted by Nolan Johnson, this insightful discussion dives deep into the evolving world of adhesives and coatings—materials that are redefining performance, reliability, and design in modern electronics manufacturing. Dymax's Doug Katze, a leading expert in adhesive technologies, delivers what can only be described as a master class on how these critical materials are adapting to meet rapidly changing market demands.
Sealed for Survival: Potting Electronics for the Toughest Environments
10/29/2025 | Beth Massey, MacDermid Alpha Electronics SolutionsElectronics deployed in harsh conditions face relentless threats from vibration, impact, chemical contaminants, airborne pollutants, and moisture, conditions that can quickly lead to failure without robust protection. Potting, the process of encapsulating electronics in a protective polymer, is a widely used strategy to safeguard devices from both environmental and mechanical hazards.