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MacDermid Alpha Electronics Solutions to Feature an Integrated Materials Platform Engineered for Long-Term Reliability at Productronica
November 12, 2025 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
Every advancement in electronics raises expectations for enhanced performance and environmental stewardship. Meeting these challenges demands materials engineered for reliability and developed to support sustainable manufacturing. Industry momentum across connected devices, high-reliability automotive electronics, and rapidly increasing compute density is elevating the role of materials selection as a core driver of long-term system performance.
At Productronica Europe 2025 (November 18–21 in Munich, Germany), MacDermid Alpha Electronics Solutions will feature proven solutions that demonstrate measurable gains in reliability, process stability, and sustainability through a connected materials approach to soldering, reinforcement, and thermal management.
“Reliability can mean different things for different applications, but it ultimately takes shape at the materials level, where integrity under thermomechanical stress determines how long a system will hold up in use. The best results come from designing in the right level of performance upfront, rather than risking failures in the field. When materials are matched to the actual demands of the application, it supports longer service life, improves first pass yield, and protects total cost of ownership.” said Scott Lewin, Business Development Director.
Featured Technologies
MacDermid Alpha will feature three complementary solutions engineered for long-term performance while supporting sustainable manufacturing. ALPHA® OM-100 SnCX® 07 Solder Paste delivers dependable lead- and silver-free performance with reduced energy requirements and total cost. ALPHA® HiTech® CF31-4026 Edgebond reinforces BGA components in high-temperature applications while maintaining reworkable flexibility for serviceability. Electrolube® LGF200 and LGF400 Liquid Gap Fillers provide stable thermal management and simplified application across a wide operating range.
Together, these solutions reinforce board-level reliability, improve manufacturing efficiency, and align with evolving sustainability expectations. Visitors are invited to stop by Booth A4-349 to learn how these materials can advance their reliability and performance objectives.
Advancing Reliability with Purpose
MacDermid Alpha’s presence at Productronica Europe underscores its ongoing commitment to helping manufacturers meet the highest standards of reliability and sustainability. By combining proven materials with process insight and technical expertise, the company enables electronics that perform with confidence from initial design through dependable operation.
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Brent Fischthal - Koh YoungSuggested Items
Indium Expert to Tackle Reliability Challenges in AI and High-Performance Computing at EPTC 2025
11/27/2025 | Indium CorporationIndium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held December 2-5, 2025, in Singapore.
Connect the Dots: The Future of Designing for Reality—Electroless Copper
11/26/2025 | Matt Stevenson -- Column: Connect the DotsOn a recent episode of I-Connect007’s On the Line With… podcast, we discussed electroless copper deposition—depositing a thin copper layer into the through-holes and vias of what will eventually become a printed circuit board. Specifically, it is a chemically catalyzed deposition of copper, mainly to the epoxy inside the holes (as well as on the entire surface of the board). Electroless differs from electrolytic in that electrolytic deposition relies on electricity.
The Impact of the AI Boom on PCB and Raw Materials Supply Chains
11/13/2025 | Mark Goodwin, Ventec International GroupThe PCB industry is entering a period of unprecedented structural change, driven by the demands of artificial intelligence and advanced computing. What was once a cyclical market has become a capacity race. It’s one that rewards foresight, collaboration, and strategic supply partnerships. Understanding these dynamics is essential for maintaining stability and growth across all market segments. This report, created by Ventec International Group, provides a clear view of how AI-driven demand is reshaping the PCB materials landscape and what actions are required to secure long-term supply.
UHDI Fundamentals: An Overview of UHDI Substrate Materials and Vias
11/13/2025 | Anaya Vardya, American Standard CircuitsThe rapid proliferation of 5G/6G communications, Internet of Things (IoT), high-performance computing (HPC), AI, and medical electronics has driven the need for increasingly compact, high-performance circuit packaging. UHDI, defined by feature sizes well below traditional HDI, addresses these demands by enabling ultra-fine lines, dense via interconnects, and embedded passive functionality. Understanding the materials and layering strategies in UHDI is essential for advancing both manufacturing and application design
Real Time with... SMTAI 2025: Enhancing Device Reliability With Innovative Materials from MacDermid Alpha Electronics Solutions
11/10/2025 | Real Time with...SMTAIMarcy LaRont speaks with Anna Lifton, MacDermid Alpha Electronics Solutions, who discusses the significance of reliability in devices through advanced materials. Anna highlights MacDermid Alpha's foray into polymer chemistry, showcasing new UV curing materials that address electrochemical reliability and thermal cycling challenges. The conversation also covers the difficulties hardware manufacturers encounter, particularly in thermal management and environmental compatibility.