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The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.

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ICT Spend in Asia/Pacific to Reach $647 Billion in 2026

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According to the latest update of the International Data Corporation’s (IDC) Worldwide ICT Spending Guide Enterprise and SMB by Industry, ICT spending across Asia/Pacific excluding Japan and China (APEJC) is forecast to reach $647 billion in 2026 and is projected to surpass $758 billion by 2029.
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