Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Pratt & Whitney Invests $25 Million to Expand Precision Parts Manufacturing in Poland

09/08/2026 | RTX
Pratt & Whitney, an RTX business, is investing $25 million (PLN 95 million) to expand its manufacturing facility in Niepołomice, Poland, which is dedicated to producing complex tubular assemblies for commercial and military engines.

Boeing Delivers Final High-speed Service Satellites

09/08/2026 | Boeing
Boeing announced delivery of the final three O3b mPOWER satellites – F11, F12 and F13 – to space solutions provider SES.

Mek (Marantz Electronics) Launches Redesigned PowerSpector JSAz 350 Desktop AOI

09/08/2026 | Mek (Marantz Electronics)
Mek (Marantz Electronics), a global specialist in Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) technology, has announced the availability of its newly redesigned PowerSpector JSAz 350 desktop AOI system.

proteanTecs, MegaChips Partner on Health and Performance Solutions for Next-Gen LSIs

09/04/2026 | BUSINESS WIRE
proteanTecs®, the leading provider of health and performance management solutions for advanced electronics, announced it is collaborating with MegaChips on the integration of proteanTecs’ embedded monitoring technology into MegaChips’ next-generation ASIC and LSI digital systems.

Beyond the Chip: Indium Highlights AI Materials Solutions at SEMICON Taiwan 2026

09/04/2026 | Indium Corporation
As artificial intelligence (AI) and high-performance computing (HPC) continue to accelerate semiconductor innovation, the industry is moving beyond the challenge of building a more powerful chip. Increasingly complex packaging, higher power density, tighter thermal requirements, and demands for faster, more cost-effective manufacturing are making system-level performance and the broader manufacturing ecosystem critical to the next generation of AI.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in