Photonics Systems Group Introduced Next-Generation Laser Depaneling System

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Photonics Systems Group (PSG), a specialist in laser micromachining for the electronics industry, has launched its next-generation advanced laser depaneling system for PCBs. The InnoLas DP10X0 is specifically designed for PCB assembly operations. It was demonstrated for the first time at Productronica 2025 in Munich and is now commercially available.

The new platform provides a large working area of 18” x 18” (460 mm x 460 mm) and uses a high-power laser source at 532 nm wavelength for high throughput and clean, residue-free cuts. It is designed to balance performance with an attractive total cost of ownership, enabling laser depaneling in price-sensitive applications previously restricted to mechanical routers. The system includes a high-performance galvo scanner for beam delivery, an integrated vision system for automatic alignment and positioning, and a built-in automatic laser power meter for real-time process monitoring and calibration. Another novelty for the InnoLas DP10X0 is the newly integrated IPC-HERMES-9852 machine-to-machine communication standard along with OPC UA for vertical MES integration and Industry 4.0 automation and traceability.

A core element of the new laser depaneling system is its unique design, that supports field upgrades such as dual laser sources and automated parts handling, which significantly extends the system lifespan and accommodates future growth. "The modular architecture of the InnoLas DP10X0 sets a new standard for future-proof design in the industry," said Niles Krauch, CTO of Photonics Systems Group. "It enables upgrades to laser engines that may not yet exist, delivering a level of sustainability and investment protection that is unique in PCB laser depaneling systems."

Every system includes on-site installation, application-specific process development, operator training, and PSG’s worldwide service and support.