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Zuken Unveils Panel Builder 2026 for E3.series to Advance Connected Manufacturing
December 2, 2025 | ZukenEstimated reading time: 2 minutes
Zuken announced the release of Panel Builder 2026 for E3.series, the latest update to its advanced manufacturing design platform within the E3.series suite. Built for control panel and switchgear production, Panel Builder 2026 enables engineering and manufacturing teams to generate intelligent wiring and assembly instructions directly from electrical design data, improving consistency, speed, and traceability.
The 2026 release introduces advanced new capabilities that enhance collaboration, streamline workflows, and scale production across increasingly complex manufacturing environments, Teams can deliver more panels in less time while maintaining quality and alignment with engineering intent.
“This release represents a real step forward in how we bridge engineering and manufacturing,” said Paul Harvell, vice president of engineering at Zuken USA. “By embedding live feedback, supporting variant-heavy production, and integrating with a wider range of equipment, we’re reducing the friction between design and delivery. Panel Builder 2026 isn’t just an upgrade—it’s a shift toward smarter, more connected production lines.”
Track repeat builds with greater control
Panel shops often produce multiple builds of the same design to support high-volume orders and reuse proven configurations. Multiple Build Tracking lets production supervisors drive wiring tasks for identical panels while tracking a complete history linked to a single panel. This helps wiring operations scale with consistency and traceability.
Strengthen connected manufacturing automation
Panel Builder 2026 strengthens Zuken’s connected manufacturing strategy with expanded support for automated wire processing. Enhancements to the PWA 6000 output ensure alignment with Wiring Task Manager wire data and sort order, helping manufacturers maintain accuracy and efficiency from engineering through final assembly.
Optimize wiring workflows and technician guidance
New enhancements streamline build preparation and work assignments for engineers and project managers:
- The Skip Attribute feature adds precision to wiring logic by enabling selective exclusion of devices or pins based on attribute values, which is ideal for custom or variant builds.
- Engineers can optimize work instructions with pin-level wire sorting, offering more granular control than traditional device-level sorting.
Technicians gain more intuitive, actionable digital work instructions, including the ability to toggle between 2D and 3D sheets based on the installed wire. This makes assembly more visual and error-resistant. Enhanced filtering options, including “completed/total” indicators, simplify tracking progress and task prioritization, giving technicians more relevant, real-time information at their fingertips.
“The new workflow controls and visualization options are designed for the realities of modern panel shops,” said Geoffrey Ng, E3.series technical marketing manager at Zuken USA. “Technicians see only the most relevant tasks, supervisors can react to changes faster, and engineering updates flow through to the shop floor without rework or confusion.”
Improve assembly coordination on the shop floor
The Panel Builder Assembly module continues to evolve in the 2026 update, providing improved task management and adaptability. New filtering options make it easier for technicians and supervisors to locate and organize tasks in complex builds. Loading changes to the .e3s file without losing existing tasks allows late-stage design updates to be incorporated without disrupting production workflows.
With Panel Builder 2026, Zuken reinforces its commitment to connected, adaptable manufacturing. From multi-build support to enhanced automation and real-time collaboration tools, this release empowers engineering and production teams to work smarter, faster, and with greater precision.
Panel Builder 2026 is available in late December as part of Zuken’s E3.series suite.
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Ventec Evaluates US Manufacturing Facility to Support North American Growth
04/28/2026 | Ventec International GroupVentec International Group today announced that it is evaluating the potential establishment of a manufacturing facility in the United States to support its growing North American customer base with high-performance laminate and prepreg materials.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
American Made Advocacy: Rebuilding America’s Military Stockpiles Begins With Microelectronics
04/28/2026 | Shane Whiteside -- Column: American Made AdvocacyCurrent world events demonstrate the fragility of long-distance supply chains transiting multiple zones of conflict. The U.S. military is currently drawing down supplies of key munitions and other electronic systems at unprecedented rates.1Every one of those systems is powered by printed circuit boards. The American PCB industry has kept pace with peacetime demand for the defense industry, but will now be called upon to increase production to a wartime footing at rates not seen in decades.
Skydio Commits $3.5B to Expand U.S. Manufacturing and Secure American Drone Leadership
04/27/2026 | PRNewswireSkydio, the largest U.S.-based drone manufacturer and the world leader in flying robots, announced plans to invest $3.5 billion in the United States over the next five years to expand its domestic manufacturing, accelerate R&D, and strengthen American supply chains.
Amcor Opens Advanced Healthcare Packaging Coating Facility in Malaysia
04/27/2026 | PRNewswireAmcor, a global leader in developing and producing responsible packaging solutions, opened an advanced healthcare packaging coating facility in Subang Jaya, Selangor, marking a significant expansion of its manufacturing footprint in Malaysia and Southeast Asia.