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On the Line With… American Standard Circuits: Ultra HDI Releases Episode 10
December 3, 2025 | I-Connect007Estimated reading time: 1 minute
I-Connect007 is pleased to announce the release of Episode 10 of On the Line With… American Standard Circuits: Ultra HDI. In this episode, host Nolan Johnson sits down with John Johnson of American Standard Circuits for a forward-looking discussion on how Ultra High Density Interconnect (UHDI) technology is reshaping some of the most demanding applications in the medical electronics space.
Johnson outlines the market forces pushing medical devices toward increasingly smaller, lighter, and more powerful designs, with UHDI emerging as a critical enabler. From minimally invasive “pill cameras” to next-generation neural implants, UHDI circuitry is making it possible to put more intelligence into smaller form factors while meeting stringent requirements for long-term biocompatibility and reliability.
One major advantage of UHDI in medical applications is its ability to eliminate materials that pose risks inside the human body. Johnson explains how UHDI circuit designs can avoid nickel and copper altogether, relying instead on palladium and gold, which are safer, inert metals for long-term implantation or extended internal use.
The episode also explores how UHDI helps solve the longstanding SWaP (size, weight, and power) challenges in medical electronics. Smaller circuitry that draws less power isn’t just convenient, it’s vital for devices that live inside the human body. Wearable and even implantable tracking technologies become more feasible when components shrink in size, reduce power requirements, and deliver the high-reliability healthcare solutions that are in demand.
Listeners will gain insight into how these ultra-miniaturized circuits are enabling a new era of medical innovation and what’s ahead as the technology continues to evolve.
To hear the full conversation, listen to Episode 10 now.
All previous episodes of On the Line With… American Standard Circuits: Ultra HDI are available for free download here.
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Design007’s Top 10 Reader’s Picks for 2025
01/08/2026 | Nolan Johnson, I-Connect007The design dynamic duo, Design007 Magazine and the Design007 Week newsletter, covered a wide range of topics in 2025. Here are the top 10 design-related articles, columns and news reports for the year. This list, comprised of two columns, three articles, and five news items, relies entirely on readership numbers, making for as fair a comparison as possible.
UHDI Fundamentals: An Overview of UHDI Layer Types
01/02/2026 | Anaya Vardya, American Standard CircuitsUHDI layer types include core, sequential lamination build-up; microvia; embedded and passive antennas and inductors; and embedded functional, protective, and hybrid rigid-flex layers. Together, they enable ultra-fine features, dense interconnects, high-frequency performance, and miniaturized system designs. UHDI typically requires multiple SBU cycles, where thin dielectric and copper layers are drilled for microvias, plated, imaged, and laminated sequentially to build up to the final design from the inside out.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/19/2025 | Nolan Johnson, I-Connect007We are days away from the end of 2025 and the beginning of 2026. This Jan. 1 will mark not only the end of a year, but also the end of a quarter-century. Doors are closing, while others are opening, and it wasn’t until I collated my must-reads this week that I noticed that a similar theme, though perhaps with more grace than in other current events around the globe. First up is the final episode of John Johnson’s series on UHDI. If you’re the type of person who reads the last chapter of a book first, definitely start with this episode, then listen to the rest of the series.
Final Episode of I-Connect007’s UHDI Podcast Series Now Available On Demand
12/17/2025 | I-Connect007I-Connect007 announces the release of the final episode of its podcast series, On the Line With… American Standard Circuits: UHDI. Episode 12, titled “UHDI? It Depends,” brings the series to a close with an engaging, FAQ-driven discussion addressing the PCB industry’s most common questions about ultra-high-density interconnect (UHDI) technology.
On the Line With… Releases Episode 11: Beyond UHDI—The Future of PCB Technology
12/10/2025 | I-Connect007I-Connect007 is pleased to announce the release of Episode 11 of On the Line With… American Standard Circuits: Ultra HDI. In this episode, host Nolan Johnson continues his conversation with ASC’s John Johnson, turning the spotlight toward the next decade of PCB innovation and what lies beyond today’s breakthroughs in Ultra High Density Interconnect (UHDI).