Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Diraq Deploys First Silicon Spin Quantum Computer in Commercial Data Center

11/12/2026 | Diraq
Diraq has installed the world's first silicon spin quantum computer inside a commercial data center, now live at Equinix in Sydney, Australia.

Scale-out: From Individual Servers To Interconnected Compute Systems

11/12/2026 | Chetan Arvind Patil, Marvell Technology
The semiconductor industry is moving beyond traditional chip-level scaling toward interconnected computing architectures. Growing demand for AI, high-performance computing (HPC), and data-intensive applications requires greater computing capacity, memory bandwidth, and communication efficiency. As we know, advanced packaging plays an important role in supporting the semiconductor technologies that enable these systems. While scale-up increases the capability of tightly coupled computing systems, scale-out enables those resources to work together at a larger infrastructure level.

From Wafer-level Inspection to System-level Scaling: A Preview of the November Advanced Electronics Packaging Digest

11/11/2026 | I-Connect007 Editorial Team
From wafer-level inspection and precision dispensing to interconnected computing architectures and electronics designed for extreme environments, the November issue of Advanced Electronics Packaging Digest (AEPD) explores how increasing complexity is driving new approaches to performance, reliability, and process control.

Quantinuum, RIKEN Expand Quantum-AI Partnership in Japan

11/10/2026 | PRNewswire
Quantinuum and RIKEN Expand Partnership to Accelerate the Commercialization of Quantum-AI Hybrid Supercomputing in Japan

EV Group Advances Qubit Scaling Through Advanced Packaging

11/09/2026 | PRNewswire
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, announced that it is supporting quantum chip developers and manufacturers in addressing the complex manufacturing requirements associated with scaling quantum computing systems.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in