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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Getters for Hermetic Packages: Mechanisms, Reliability Impact, and MacDermid Alpha Electronics Solutions

06/11/2026 | Michael Previti, MacDermid Alpha Electronics Solutions
Hermetic packages protect chips, lasers, and sensors from the outside world, but the cavity inside can still change after seal. Small amounts of water, hydrogen, carbon dioxide, and organic vapor may remain after build or may form later from adhesives, films, and other internal materials. Getters reduce that risk by creating a planned sink for those gases inside the package. When teams choose the right getter early, they hold the headspace steady, cut reliability escapes, and lower the life-cycle cost of a high-value device.

H2 Core Systems Builds Scalable Hydrogen Energy Solutions with Siemens Xcelerator

05/18/2026 | Siemens
Siemens has announced that H2 Core Systems, a startup focused on modular hydrogen-based energy systems, is using the Siemens Xcelerator platform of software and automation portfolio to design and manufacture compact, highly efficient hydrogen energy systems that generate and store clean energy where it is needed.

SINBON Electronics, Nexcellent Energy Partner on Urban Hydrogen Energy

05/13/2026 | PRNewswire
"We have always believed in working with partners who share the same vision," said Alex Shiung, Business Development Assistant Vice President at SINBON. "Together, we hope to build an ecosystem that is friendly to the environment and beneficial for the planet."

Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress

08/04/2025 | Michael Carano -- Column: Trouble in Your Tank
Metallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.

Nolan’s Notes: Emerging Trends in 2025

01/06/2025 | Nolan Johnson -- Column: Nolan's Notes
January is a traditional time to mark changes in our lives. A new year can signal new beginnings. But change is constant. So, as we flip over the calendar into 2025, we look at what’s ahead for the EMS supplier industry. What are your concerns and challenges? What trends are emerging? What can you expect from a new administration?
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