I-Connect007 Announces the December Issue of Advanced Electronics Packaging Digest

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Landing in inboxes Monday, Dec. 15, the next issue of Advanced Electronics Packaging Digest (AEPD) explores some of the most pressing questions shaping U.S. advanced electronics capability, from defense readiness to power constraints and the fast-moving world of printed electronics. This month, we spotlight the technologies, strategies, and industry perspectives driving next-generation manufacturing forward:

• Defense electronics specialists warn that the U.S. cannot maintain a technological advantage while relying on overseas PCB, substrate, and component supply chains. This special roundtable will highlight why advanced packaging has become a national-security imperative.
   
• Schneider’s Mark Bidinger discusses emerging approaches to energy management and why power may be the defining barrier to progress. This month’s issue underscores a central message: Advanced packaging is foundational to U.S. competitiveness, national security, and the viability of next-generation electronics.
   
• At SEMICON West, Doug Schardt of Komori America detailed how the company evolved from traditional printing to a leader in printed electronics, including gravure offset technology, conductive ink research, and the role AI chips will play in accelerating PE adoption.

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