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Advanced Electronics Packaging Digest

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HUMAIN, Compal Partner to Expand Cloud-to-Edge AI at LEAP 2026

09/01/2026 | Compal Electronics Inc.
As artificial intelligence rapidly expands beyond centralized cloud computing into real-world applications, HUMAIN has selected Compal Electronics as its long-term strategic ODM partner to support the development and manufacturing of its next-generation AI infrastructure and intelligent computing platforms.

NVIDIA, MediaTek Deepen AI Edge-to-Cloud Partnership

09/01/2026 | NVIDIA
NVIDIA and MediaTek announced a deepening of their longstanding collaboration to build the next generations of AI computing platforms — spanning AI infrastructure, local AI computing and automotive.

India’s Enterprise Infrastructure Market Surges 30% on AI and Component Costs

08/26/2026 | IDC
According to IDC’s Worldwide Quarterly Enterprise Infrastructure Tracker, India’s enterprise infrastructure market reached US$1.67 billion in the first quarter of 2026, up from US$1.28 billion a year earlier.

Diraq Opens First U.S. Quantum Laboratory in Chicago

08/24/2026 | Diraq
Diraq has opened its first U.S. laboratory in Chicago as part of the Illinois Quantum and Microelectronics Park’s (IQMP) On-Ramp program at mHUB.

Gartner Forecasts $1.6 Trillion Global Semiconductor Revenue in 2026

08/24/2026 | Gartner, Inc.
Global semiconductor revenue is expected to reach $1.6 trillion in 2026, increasing 92% from 2025 revenue of $809 billion, according to Gartner, Inc., a business and technology insights company. In 2027, it is forecast to total $1.9 trillion.
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