Indium Corporation Launches New Solder Paste for High Print Consistency and Easy Cleanability

Estimated reading time: 1 minute

Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of SiPaste^® C312HF, a halogen-free, cleanable solder paste formulated for fine-feature printing. Designed with Type 7 powder for aperture sizes down to 60μm, it enables fine-feature printing in advanced system-in-package applications.

SiPaste^® C312HF boosts process yields that combine best-in-class stencil print transfer efficiency and excellent stencil life with consistent printing, excellent response-to-pause, and superior reflow performance. SiPaste^® C312HF post-reflow flux residue can be cleaned with a standard cleaning process using semi-aqueous chemistries or a saponifier, or it can be used as a standard no-clean paste in processes where post-reflow cleaning is not required.

SiPaste^® C312HF delivers several benefits to users, including:

• Consistent with low standard deviation solder deposit spread across multiple prints
• Outstanding slump resistance
• Low voiding across all components
• Optimized powder formulation and flux vehicle
• Requires minimal stencil cleaning during printing
• Wide reflow profile window
• Excellent wetting capability on various metallization

Indium Corporation’s SiPaste^® series is specifically designed for fine-feature printing with fine powders ranging from Type 5 to Type 8, including the SiPaste^® C312HF with Type 7 powder. The products help Avoid the Void^®, reduce slumping, and demonstrate consistent superior printing performance.