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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Koh Young’s Answer to Wafer-level Inspection Challenges

11/12/2026 | Marcy LaRont, I-Connect007
At SEMICON West, I caught up with Allen Phung, head of sales at Koh Young America, where we pivoted from our more traditional focus on SMT-related tech to talking about semiconductors and advanced packaging. Koh Young’s semiconductor business provides inspection and metrology systems for advanced packaging, including micro-solder deposits, high-density substrates, and wafer-level packaging, addressing the demanding requirements as components shrink and interconnect complexity grows.

From Wafer-level Inspection to System-level Scaling: A Preview of the November Advanced Electronics Packaging Digest

11/11/2026 | I-Connect007 Editorial Team
From wafer-level inspection and precision dispensing to interconnected computing architectures and electronics designed for extreme environments, the November issue of Advanced Electronics Packaging Digest (AEPD) explores how increasing complexity is driving new approaches to performance, reliability, and process control.

Infineon Achieves World-First 300mm SiC Wafer Milestone

11/11/2026 | Infineon
Infineon Technologies AG has successfully processed 300-millimeter silicon carbide wafers into functional power devices at its fab in Villach, Austria.

SEMI Reports 13.4% Growth in Q3 Silicon Wafer Shipments

11/05/2026 | SEMI
The SEMI Silicon Manufacturers Group (SMG) reported, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 13.4% year-on-year to 3,756 million square inches (MSI) from the 3,313 MSI recorded during the same quarter of 2025.

Fraunhofer IPMS Showcases New Technologies for the Future of Semiconductor Industry

11/03/2026 | Fraunhofer IPMS
At SEMICON Europa 2026, the Fraunhofer Institute for Photonic Microsystems IPMS will showcase current research results and technological developments for the semiconductor industry.
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