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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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HDI Production Line Launch at STARTEAM GLOBAL’s JST Factory
December 15, 2025 | STARTEAM GLOBALEstimated reading time: 1 minute
STARTEAM HDI Technology is thrilled to share the launch of our HDI production line at the JST factory in Jiangyou, China. This marks more than the addition of new equipment, it’s a step forward in how we support our customers and grow together.
HDI Technology Benefits
Electronics are evolving fast, and HDI technology helps us deliver the density, performance, and reliability that modern applications demand. By investing now, we’re opening new design possibilities, speeding up development cycles, and preparing for next‑generation needs in automotive, IoT, industrial automation, medical devices, and advanced consumer products.
Technical Capabilities
Our new HDI line offers:
- Capacity: 2+N+2 – enabling complex stack‑ups that support advanced circuit designs.
- Heavy copper (inner and outer layers up to 6oz): ideal for power electronics and applications requiring durability under high current loads.
- Copper In‑Lay: providing enhanced thermal management and mechanical strength for demanding environments.
- High layer counts (up to 20 layers): allowing for compact designs with greater functionality in limited space.
- High‑frequency material (PTFE): ensuring signal integrity and reliability for next‑generation communication and IoT devices.
A Shared Celebration and Future Outlook
Our CEO Daniel Jacob, Chief Manufacturing Officer HB Yang, and General Manager Victor Huang joined the opening ceremony — marking this achievement together.
A special quote from Klaus Jacob, father of Daniel and founder of JCB in 1988—the beginning of what became STARTEAM GLOBAL: “I am touched and proud that after 37 years since our journey began, we can finally open our first HDI production line. With this investment, we will deliver more technologies to our loyal customers and open doors for new markets.”
This milestone ensures that whether the need is durability, miniaturisation, or high‑speed performance, we can provide a tailored solution. With this new HDI line, we strengthen our ability to support customers with the technologies they need, and we look forward to growing together into the future.
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Brent Fischthal - Koh YoungSuggested Items
From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation
04/30/2026 | I-Connect007I-Connect007 wraps up its six-part podcast series, PCB Materials: The Backbone and Future of Electronics, with Episode 6 and a discussion focusing on innovation. In Episode 6, Marcy LaRont speaks with Isola CTO Kirk Thompson about a critical turning point for the PCB industry as innovation accelerates. As data rates climb and demands from AI infrastructure, power density, flexible electronics, photonics, and chiplet integration intensify, traditional material assumptions are no longer sufficient.
ASC’s John Johnson Bullish on the U.S. and High-tech PCBs
04/28/2026 | Marcy LaRont, I-Connect007It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.
SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation
04/14/2026 | Marcy LaRont, I-Connect007The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.
SMTA Ultra HDI Symposium, Day 1: AI at the Core or Out of the Game
04/13/2026 | Marcy LaRont, I-Connect007It was a beautiful 81°F morning in Arizona last Wednesday as I headed to the third annual SMTA Ultra HDI Symposium, focused on AI and ultra high density interconnect technology. Strategically held as part of Arizona’s Tech Week, this year’s conference took place in Avondale in Phoenix's West Valley. The event moved from the cozy offices of the Peoria Sports Complex (which paid homage to baseball’s spring training world) to the larger Avondale Conference Center, highlighting the importance of this area for electronics manufacturing investment.
AdvancedPCB Strengthens HDI Process Control with New AOI Investment in Chandler, AZ Facility
03/23/2026 | AdvancedPCBAdvancedPCB has expanded its high-density interconnect (HDI) quality inspection capabilities with the installation of the CIMS Phoenix MDI AOI system in its Chandler, Arizona facility, enabling precision inspection of mechanical drills down to 150 µm in diameter.