Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
Global Sourcing Spotlight: The New Landscape of Manufacturing 
Nolan’s Notes: Five Key Changes to APEX EXPO
Altair HyperWorks 2026 Delivers Design and Simulation at Scale with AI
December 16, 2025 | AltairEstimated reading time: 3 minutes
Altair, a global leader in computational intelligence and now part of leading technology company, Siemens, announced the latest updates to HyperWorks® 2026 software. With significant advances in AI, high-performance computing (HPC), and multiphysics integration, HyperWorks 2026 enables engineering teams to accelerate innovation and improve product performance across industries using comprehensive computer-aided engineering (CAE) design and simulation.
“HyperWorks 2026 exemplifies how Altair and Siemens are driving the future of simulation and empowering engineers to design smarter, faster, and with greater confidence in real-world outcomes by bringing AI, automation, and multiphysics into a unified ecosystem,” said Sam Mahalingam, chief technology officer, Altair, and executive vice president, Siemens Digital Industries Software. “Following the acquisition by Siemens earlier this year, our commitment is to create the world's most complete AI-powered portfolio of product lifecycle intelligence software and further enhance the most comprehensive digital twin.”
HyperWorks in use at JetZero
JetZero, a pioneering aviation startup building the future of ultra-efficient air travel, is collaborating with Siemens on the development and production of JetZero's revolutionary blended wing aircraft. The innovative all-wing design aims to improve fuel efficiency by up to 50 percent, reduce noise, and advance the industry toward zero carbon emissions. Key to the fast pace of its development schedule is gaining engineering insights faster than using conventional high fidelity computational fluid dynamics (CFD) with FlightStream, part of the HyperWorks suite.
As John Vassberg, chief design officer at JetZero explains, “JetZero is pioneering the next step change in the aerospace industry and, to accomplish that at the scale the industry is demanding, means we need a toolset that allows us to work at pace and gain accurate insights early in design – which FlightStream does. It is easy for our engineering team to use, does not require the traditional high-performance computing resources of high-fidelity CFD, and gets us answers fast and without heavy resource demands. This is critical for companies like JetZero that need to iterate faster than ever before.”
HyperWorks 2026 delivers six key innovations
AI-powered design and simulation
Geometric deep learning and generative algorithms and GPU-accelerated reduced order modeling (ROM) enable near-real-time predictions and faster validation. Physics-based AI models can be deployed in secure, browser-based environments, producing results up to 1,000x faster than traditional solver simulations. Expanded support for vectors and smoothed-particle hydrodynamics (SPH) broadens domain coverage.
Enterprise-scale pre-processing and model assembly
Engineers can now simulate large, complex assemblies with speed and fluidity, shortening build and validation cycles. Enhanced navigation, batch meshing, and connector management streamline pre-processing while direct data management integration helps to ensure consistency across teams.
Integrated multiphysics simulation
Unified solvers and domain coupling allow engineers to analyze complex interactions – such as thermal-fluid or electromagnetic-structural systems – with greater fidelity. New workflows support e-motor optimization, battery safety studies, and high-temperature analysis, while co-simulation standards enhance digital continuity. Electromagnetic simulations run up to 40 percent faster and propagation modeling up to 20x faster with radar and electromagnetic compatibility (EMC) analysis expanded for next-generation applications.
Automation, collaboration and connectivity
Expanded Python and API support, intuitive no-code workflow tools, and cloud integration promote digital continuity. Enhanced visualization and plotting tools simplify result interpretation and sharing, while seamless interoperability with third-party software strengthens digital twin fidelity.
Realistic particle, fluid, and material behavior
New modeling approaches capture bulk flow, impact behavior, and high-temperature effects with greater realism. Python-based automation accelerates discrete element method (DEM) workflows and coupled solvers enable advanced studies of battery safety and material response.
Intuitive design and motion exploration
A more unified workspace transforms how engineers explore motion and refine geometry. Real-time updates across multi-window views reduce setup time, while flexible implicit modeling and direct surface editing remove geometry barriers to creativity. With clear side-by-side comparisons, teams can make faster, more confident decisions.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Proper Plane Design Techniques
02/12/2026 | I-Connect007 Editorial TeamContinuing our discussion from the November issue of Design007 Magazine on proper plane design, Kris Moyer, an instructor for the Global Electronics Association, shares techniques he teaches his PCB design students to use. When it comes to plane design, there are several challenges with modern high-speed designs. Planes, or more specifically, mirror/return paths, are critical to proper controlled impedance transmission line design. Additionally, to mitigate high-speed switching “noise,” the use of planar capacitance is now necessary and critical.
PCB Design in 2026 and Beyond
02/12/2026 | Filbert Arzola, RaytheonWe asked several experts in PCB design and fabrication about the pressures shaping PCB fabrication today, including speed, density, geopolitics, and relentless technological complexity. The results were valuable insights about where we are, where we’re headed, and importantly, what it will take to get there. Here is Filbert (Fil) Arzola's view of what will be most important and influential for PCB designers going into 2026 and beyond.
EIPC Winter Conference Review: A Focus on Miniaturization
02/12/2026 | Pete Starkey, I-Connect007The theme of the first technical session of EIPC’s Winter Conference in Aix-en-Provence on Feb. 3 was “Miniaturisation and fine-line PCB production: From design to manufacturing.” The session was moderated by EIPC Vice President Thomas Michels, CEO of ILFA in Germany. The theme of the conference is “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The opening presentation came from applications engineering specialist Dr. Roland Steim of Dyconex in Switzerland, who described how the company has addressed the challenges of miniaturisation and fine-line PCB production.
February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging
02/11/2026 | I-Connect007 Editorial TeamI-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.
EIPC Winter Conference 2026 Review: The Keynote Sessions
02/11/2026 | Pete Starkey, I-Connect007Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.