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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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SMTA Renames Event as Microelectronics Packaging & Integration Symposium

10/20/2026 | SMTA
TA is pleased to announce a new name and expanded technical scope for the former Wafer-Level Packaging Symposium.

Microscreen Continues U.S. Expansion with New Baltimore Manufacturing Facility

10/20/2026 | Microscreen
Microscreen, a U.S. manufacturer specializing in high-precision SMT solder stencils and custom tooling solutions, has opened a new manufacturing facility in Baltimore, Maryland.

Elektrobit, Microchip Partner on AUTOSAR Automotive Solutions

10/19/2026 | Microchip
Elektrobit, a global expert in automotive software, and Microchip Technology Inc., a broadline supplier of semiconductors committed to making innovative design easier through total system solutions, announced a collaboration to simplify and accelerate AUTOSAR-based software development for automotive manufacturers and suppliers using Microchip automotive platforms.

Micross Achieves Class K Qualification for Space-Grade Hybrid Microelectronics

10/16/2026 | PRNewswire
Micross Components, a leading provider of high-reliability microelectronics for aerospace, defense, and space, has achieved MIL-PRF-38534 Class K qualification from the Defense Logistics Agency (DLA) Land and Maritime for its Apopka, Florida, facility.

Draper Breaks Ground on New Microelectronics Building in Lowell

10/14/2026 | Draper Laboratory
Draper recently held a groundbreaking ceremony for a new microelectronics building in Lowell, Massachusetts. The building will house Draper's Integrated Microelectronics Production & Advanced Chip Technology (IMPACT) Center.  
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