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Advanced Electronics Packaging Digest

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Microscreen, AGI Corporation Launch MAA, Expanding Capabilities for Both Companies

09/02/2026 | Microscreen
Microscreen and AGI Corporation have formed the Microscreen AGI Alliance (MAA). The alliance adds AGI’s PCB tooling and engineering capabilities to Microscreen’s offerings, while providing Microscreen’s nanocoating technology to AGI’s customers.

GigaDevice Expands EMEA and Southeast Asia Reach with Rutronik Partnership

08/31/2026 | BUSINESS WIRE
GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, announced a new strategic franchise partnership with Rutronik Elektronische Bauelemente GmbH, one of Europe’s leading broadline distributors of electronic components.

Micron Announces Leadership Appointments to Accelerate Innovation and Growth

08/28/2026 | Micron
Micron Technology, Inc. announced the promotion of two senior executives to newly expanded leadership roles designed to further strengthen the company's execution, innovation and long-term growth strategy.

Microscreen Opens New Stencil Manufacturing Facility in Oxford, Connecticut

08/27/2026 | Microscreen
Microscreen, a U.S. manufacturer specializing in high-precision SMT solder stencils and custom tooling solutions, is pleased to announce the opening of its newest facility in Oxford, CT.

Micron Opens State-of-the-Art Training Center in Boise to Strengthen America’s Semiconductor Workforce

08/26/2026 | Micron
Micron Technology Inc., the only U.S.-based manufacturer of memory and storage solutions, opened a 60,000-square-foot Micron Training Center (MTC) in Boise, a strategic investment to strengthen the skilled talent pipeline, support advanced semiconductor manufacturing and expand education and apprenticeship pathways in Idaho.
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