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From IPC Standards to Practical DFM

10/21/2026 | Marcy LaRont, I-Connect007
DFM seems like common sense: If we know the rules a PCB must meet, why not check the design against them before it ever reaches the factory? In practice, of course, it’s not quite that simple. I caught up with Susan Kayesar, product manager at Siemens and longtime contributor to Global Electronics Association standards activities, to talk about an ongoing effort between Siemens and the Association to translate IPC requirements into practical, software-based DFM checks. Susan explains where standards lend themselves to automation, where the gray areas begin, and why checking for IPC compliance is an important starting point, but not a substitute for understanding the capabilities and limitations of the fabricator who will actually build the board.

Jaltek Achieves Nadcap Accreditation Following Norautron Acquisition

10/13/2026 | Jaltek
Luton-based electronics design and manufacturing specialist Jaltek, recently acquired by Norautron AS, an international provider of advanced electronics manufacturing services, has achieved Nadcap accreditation.

Indium Expert to Discuss Sintering Technology Standardization at IMAPS Autumn Germany 2026

10/13/2026 | Indium Corporation
Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will discuss his work to develop industry standards for sintering technologies used in electronics and power electronics at IMAPS Autumn Germany 2026, October 15-16, in Munich, Germany.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/09/2026 | Nolan Johnson, I-Connect007
Have you ridden in a robotaxi yet? Increasingly, there are sightings in some of the major cities here in the western U.S, particularly San Francisco. This past week, we published a news item from Berg Research projecting that robotaxis will grow from 6,500 deployments today to more than 1.5 million over the next 10 years. The technology for fully autonomous vehicles continues to look like an emerging tech driver for the EV sector.

Third Annual Pan-European Design Conference Important for Europe

10/08/2026 | Marcy LaRont, I-Connect007 Magazine
The Pan-European Design Conference has quickly established itself as a premier event for the European electronics design community. Now in its third year, PEDC, set for Jan. 27-28, 2027, in Amsterdam, has already attracted a record number of technical paper submissions. In this interview, Susan Kayesar, a product manager at Siemens who is an active participant in IPC design standards, discusses the upcoming conference and the trends driving its continued growth.
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