ECTC 2026 Announces Student Innovation Challenge

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The premier technical conference and product exhibition for the world’s semiconductor packaging industry, the IEEE Electronic Components and Technology Conference (ECTC), has announced a Student Innovation Challenge for ECTC 2026, the conference’s 76th anniversary. Six winning student teams will have the opportunity to attend ECTC 2026 with financial assistance, including travel costs up to a specified amount.

More than 2,000 scientists, engineers and businesspeople from more than 20 countries are expected to attend the 76th annual ECTC, which will take place May 26-29, 2026, at the JW Marriott & Ritz-Carlton Grande Lakes Resort in Orlando, FL.

“This is a wonderful opportunity for students to have a platform to showcase innovative technical skills to packaging experts from industry and academia, through competition with other student teams from around the world,:said Przemyslaw Gromala, ECTC 2026 Vice General Chair and Sr. Expert & Simulation Team Leader at Robert Bosch GmbH. “The finalist student teams gain exposure to the conference’s state-of-the-art technical program and packaging experts; networking with potential employers, including potential internships; and will have the opportunity for their work to be published in the highly regarded technical journal, IEEE Transactions on Components, Packaging and Manufacturing Technology.”

The 2026 ECTC Executive Committee is inviting teams of up to three students – eligible participants should be currently enrolled in a undergraduate (BSc) / master’s (MSc) program, or doctoral (PhD) candidates from any university. Interested student teams must pre-register by December 31, 2025 for one of the following three pre-defined challenges, each one dealing with a critical aspect of simulation and reliability in electronic packaging.