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Advanced Electronics Packaging Digest

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NVIDIA, Supply Chain Partners Expand Capacity to Accelerate AI Infrastructure Buildout

10/21/2026 | Globe Newswire
NVIDIA announced plans with a group of supply chain partners to expand global manufacturing capacity to meet growing demand for its accelerated computing and full-stack AI factory platform.

GlobalFoundries Marks Dresden Expansion, Unveils Physical AI Platform

10/16/2026 | GlobalFoundries
GlobalFoundries celebrated the topping-out of its SPRINT expansion project in Dresden and announced FDX Fusion, a next-generation platform for highly integrated, energy-efficient chips planned for development and manufacturing at the site.

Matrix Electronics Expands European Operations with Reiskirchen, Germany Office and Warehouse

10/14/2026 | Matrix Electronics
Matrix Electronics is pleased to announce the continued expansion of its European operations with the establishment of Matrix Electronics GmbH in Reiskirchen, Germany

SEL Invests More Than $500 Million to Expand U.S. Manufacturing Capacity

10/12/2026 | Schweitzer Engineering Laboratories
SEL is undertaking a sweeping expansion of its U.S. manufacturing operations, investing more than half a billion dollars in new facilities, equipment and production capacity across four states to meet growing global demand for technologies that protect, monitor and control critical infrastructure.

ACCM Expands US Manufacturing Capacity for AI Infrastructure

09/28/2026 | BUSINESS WIRE
Advanced Chip and Circuit Materials, Inc. (ACCM) announced a major expansion of its US manufacturing capacity for the Celeritas® family of advanced dielectric materials, covering the four segments of AI hardware where material supply and performance currently constrain system design: ultra-high-speed skew-free materials, low- and negative-expansion laminates for large accelerator boards, IC substrate/package core materials, and build-up materials.
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