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ACCM Expands US Manufacturing Capacity for AI Infrastructure

09/28/2026 | BUSINESS WIRE
Advanced Chip and Circuit Materials, Inc. (ACCM) announced a major expansion of its US manufacturing capacity for the Celeritas® family of advanced dielectric materials, covering the four segments of AI hardware where material supply and performance currently constrain system design: ultra-high-speed skew-free materials, low- and negative-expansion laminates for large accelerator boards, IC substrate/package core materials, and build-up materials.

AT&S, Marvell Expand Collaboration for Next-Gen AI Infrastructure

09/22/2026 | AT&S
AT&S announced an expanded collaboration with Silicon Valley company Marvell Technology, a leading provider of data infrastructure semiconductor solutions, to increase advanced IC substrate capacity for next-generation AI and cloud infrastructure.

SEL Expands Manufacturing Operations in Idaho with New Facility in Nampa

09/16/2026 | SEL
Schweitzer Engineering Laboratories (SEL) is expanding its manufacturing operations in Idaho with the purchase of a facility in Nampa.

Real Time with... THECA 2026: HKPCA on Thailand's PCB Industry Expansion

09/15/2026 | Real Time with... THECA
Canice Chung, chairman and president of HKPCA, outlines Thailand's growing importance in the PCB industry at THECA 2026. He reflects on the country's development since the 1980s, its advantages attracting new investment, and government efforts to build a skilled local workforce. Mr. Chung also discusses the expansion of Chinese PCB manufacturers into Thailand and the incentives available to companies entering the market.

Amkor Technology Expands Arizona Investment to $12 Billion

09/10/2026 | Amkor Technology
Amkor Technology, Inc., a leading provider of outsourced semiconductor packaging and test services, today announced phase 2 of its Arizona Advanced packaging and test campus.
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