Syntiant Expands NDP115 With New Ultra-Thin Packages

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Syntiant Corp., the recognized leader in ultra-low-power edge AI deployment, announced two new package options for its NDP115 Neural Decision Processor™, extending the chip’s reach into devices that demand highly efficient layouts and exceptionally compact form factors across consumer, industrial and healthcare markets.

Powered by Syntiant’s Core 2™ inference engine, the NDP115 runs speech inferences at just 280 µW (microwatts) and is designed to natively execute multiple deep neural networks across architectures such as CNNs, RNNs and fully connected networks. Ideal for advanced AI-based environmental noise reduction, close-talk and far-field speech, keyword detection and audio event classification, the NDP115 also supports I²C and pulse density modulation (PDM) interfaces for sensor fusion, including multi-axis acceleration, tilt, magnetic field and pressure sensing.

eWLB Package Streamlines Two-Layer PCB Designs

The new embedded wafer-level ball grid array (eWLB) package for the NDP115 is optimized for two-layer printed circuit board (PCB) designs, providing customers with a cost-efficient, high-performance solution for integrating edge AI into high-volume consumer electronics such as voice-enabled smart remotes, streaming devices and other smart home products.

Ultra-Thin Package Expands Possibilities for Hearing Aids and Micro-Wearables

Syntiant’s new ultra-thin NDP115 package is designed for hearing aids, earbuds and other space-constrained wearables. With a maximum height of just 0.31 mm, achieved by reducing the ball diameter to 130 μm (micrometers) and wafer thickness to 180 μm, the compact NDP115 package is enabling next-generation intelligence in the tiniest devices.

“As manufacturers look to integrate always-on intelligence into a wider range of products, Syntiant is enhancing the NDP115 portfolio with packaging options that diversify design choices,” said Nathan Nunley, product line director for NDP Hardware at Syntiant. “From consumer devices requiring streamlined PCB designs to wearable health tech requiring the thinnest form factor possible, the NDP115 packages enable our customers to design smarter, smaller and more efficient products that deliver advanced edge AI for voice and sound processing, without compromising comfort, battery life or cost.”