Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

Cadence Launches ChipStack AI Super Agent for Next-Gen Chip Design

02/16/2026 | Cadence Design Systems
Cadence announced a transformative step forward in redefining how semiconductors are designed with the launch of the ChipStack™ AI Super Agent—an agentic AI solution for front-end silicon design and verification.

HBM4 Validation Expected in 2Q26; Three Major Suppliers Poised to Shape NVIDIA Supply Landscape

02/13/2026 | TrendForce
TrendForce’s latest analysis of the HBM industry reveals that as the ongoing expansion of AI infrastructure continues to fuel GPU demand, NVIDIA’s upcoming Rubin platform is expected to become a major catalyst for HBM4 adoption once mass production begins.

HBM4 Mass Production Delayed to End of 1Q26 By Spec Upgrades and Nvidia Strategy Adjustments

01/08/2026 | TrendForce
TrendForce’s recent investigations indicate that Nvidia has revised the HBM4 specifications for its Rubin platform in 3Q25, raising the required per-pin speed to above 11 Gbps.

Magna AI Joins NVIDIA Inception Program to Advance Production-Grade AI at Scale

01/08/2026 | BUSINESS WIRE
Magna AI, a global full-value-chain AI transformation leader established through a partnership between Trend Micro and Wistron, announced that it has joined the elite ranks of global AI organizations delivering production-scale intelligence as part of the NVIDIA Inception program.

Fujitsu Unveils Kozuchi Physical AI 1.0 Integrating Physical and Agentic AI with NVIDIA Technologies

12/26/2025 | ACN Newswire
Fujitsu announced the development of Fujitsu Kozuchi Physical AI 1.0, a new technology designed to seamlessly integrate physical and agentic AI.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in