-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
The Test Connection, Inc. Partners with Capitol Technology University to Support NASA RockSat ODIN Payload
January 8, 2026 | The Test Connection Inc.Estimated reading time: 2 minutes
Capitol Technology University continues to advance its RockSat sounding rocket payload, Observation & Detection Interpreted by Neural-networks (ODIN), following its selection by NASA for a June 2026 sounding rocket mission. The payload was chosen based on the strength of its scientific objectives and the technical maturity of its design, successfully completing two NASA design reviews and progressing toward flight readiness.
With support from The Test Connection, Inc. (TTCI), Capitol Technology University is strengthening its RockSat program through industry-led reviews of design, fabrication, and assembly, along with electrical testing conducted prior to final assembly reviews. This collaboration helps ensure the payload meets the rigor and reliability expectations required for spaceflight hardware.
ODIN is being developed by a multidisciplinary student team representing Astronautical Engineering, Data Science, and Computer Science. Working collaboratively, the team is building an advanced spaceflight payload that applies artificial intelligence to interpret science data during flight and dynamically prioritize data for transmission.
The payload integrates an X-ray camera, a gamma-ray spectrometer, an onboard neural-network AI system, and a custom Iridium satellite communications downlink. This architecture enables near-real-time visibility of mission data on campus, presented through a live dashboard designed and implemented by the student team.
A defining feature of ODIN is its use of AI to perform real-time data analysis within the constraints of limited spaceflight bandwidth. By evaluating data during flight and selecting the most valuable information for downlink, the system demonstrates an innovative approach to operational AI in space environments.
TTCI serves as the industry liaison for the ODIN project, providing guidance on system integration, test strategy, and mission-readiness considerations. The partnership highlights the value of industry engagement in helping student teams meet the standards required for aerospace flight programs.
“We’re proud to work with emerging engineering talent and help shape the next generation of professionals entering our industry,” said Bert Horner, President of The Test Connection, Inc. “Projects like ODIN give students exposure to real-world expectations, disciplined engineering processes, and the level of rigor required for successful flight hardware.”
Additional technical and standards-based support is provided through The Training Connection LLC, TTCI’s sister company, with a focus on manufacturing quality and design discipline critical to spaceflight success.
“Introducing young engineers to IPC-driven design, manufacturing, and quality control helps them understand what it truly takes to succeed in flight hardware,” said Bill Graver, Master Instructor Trainer (MIT) and Technical Liaison for The Training Connection LLC. “Applying IPC principles early improves reliability, reduces risk, and significantly strengthens a project’s readiness for flight.”
Through participation in the RockSat program, students gain hands-on experience with NASA-style design reviews, mission-critical system development, AI-enabled data processing, and real-time telemetry and communications—preparing them for careers in aerospace, defense, data science, and advanced electronics engineering.
As the ODIN payload progresses through final design, integration, environmental testing, and launch preparation, The Test Connection will share updates highlighting key technical milestones and student achievements on the path to flight in 2026.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
EIPC Winter Conference Review: From Innovation to Qualification
02/13/2026 | Pete Starkey, I-Connect007Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”
Google’s High-Speed Interconnect Architecture to Push 800G+ Optical Transceiver Share Past 60% by 2026
02/10/2026 | TrendForceGoogle’s next-generation TPU, Ironwood, integrates a 3D Torus network topology with the Apollo optical circuit switch (OCS) all-optical network, marking a major step forward in AI data-center interconnect design.
Survey Says: Avnet's Insights Into How Engineers Are Adopting AI
02/09/2026 | Nolan Johnson, I-Connect007Avnet regularly surveys engineers to learn what they’re thinking. That sort of information is quite important to Alex Iuorio, vice president of supplier development at Avnet. In this interview, Alex talks about what he’s learned from the most recent survey and its implications to the supply market in 2026 and beyond. No surprise, AI plays a remarkably large role in all the current trends.
AI-Fueled Supercycle Propels Memory Market Revenue to More Than Twice That of Foundry Industry
02/09/2026 | TrendForceThe current AI surge is anticipated to boost both the memory and wafer foundry sectors to record-breaking revenues by 2026, based on TrendForce’s recent data. Limited supply and rapidly increasing prices are likely to grow the memory market's total worth to $551.6 billion.
USI Subsidiary Universal Optoelectronics Acquires Controlling Stake in Eugenlight Technologies
02/06/2026 | USIUSI announces that its wholly-owned subsidiary, Universal Optoeletronics Co., Ltd., completed the acquisition of a controlling stake in EugenLight Technologies.