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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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TROOPS Invests $12M in Southeast Asia AI Infrastructure Unit

09/24/2026 | ACN Newswire
TROOPS, Inc. is committing US$12 million to start a new business unit focused on artificial intelligence infrastructure in Southeast Asia, a growing market that attracted more than US$55 billion of investment over the last year.

The Factory of the Future Still Needs People

09/23/2026 | Michael Gleason, GreenSource Fabrication
Modern PCB factories can incorporate sophisticated automation, advanced process controls, machine vision, extensive traceability, real-time data collection, predictive analytics, and AI. These technologies are enabling manufacturers to see, measure, and identify opportunities that once depended almost entirely on human observation. They also create an opportunity to think differently about the manufacturing workforce. The factory of the future brings technology and human expertise together, allowing each to contribute where it creates the greatest value.

Latest Episode of Qnity Podcast Series Explores Materials for Mission-Critical Reliability

09/23/2026 | I-Connect007
The second episode of Engineering What’s Next, a podcast series from Qnity, is now available on I-Connect007. The series explores the materials, technologies, and expertise shaping the next generation of electronics. In “Materials for Mission-Critical Reliability,” host Marcy LaRont speaks with Rich Wessel, Industrial Application Leader, Laminates, about the increasingly complex demands placed on materials as electronics move into more challenging and mission-critical applications.

3 Key Takeaways from The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness

09/22/2026 | I-Connect007
As PCB technology has evolved, the structures being evaluated become more complex. But have the methods used to determine their reliability evolved at the same pace? In The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness, Bob Neves challenges some long-held assumptions about how the electronics industry evaluates PCB via structures. He draws on decades of reliability experience, and examines not only how we test, but what those tests actually tell us.

Fresh PCB Concepts: Managing PCB Trace Width and Spacing

09/22/2026 | Team NCAB -- Column: Fresh PCB Concepts
As a fabricator, I know that trace width and spacing are some of the first items reviewed when determining whether a PCB can be manufactured reliably. They may look like simple dimensions in the design data, but the ability to reproduce them consistently depends on several factors, such as the circuit's location, the copper weight used, the design density, and any additional plating requirements. These can all change what is realistically achievable.
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