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Bringing Standards-based Thinking Earlier Into Rigid-flex Design

11/12/2026 | Peter Tranitz, Global Electronics Association
Rigid-flex designs are helping electronics manufacturers meet growing demands for smaller, lighter, and more reliable products. From aerospace and defense systems to medical devices, industrial electronics, automotive applications and advanced consumer products, rigid-flex technology can provide important advantages in packaging density, weight reduction and interconnect reliability. But rigid-flex design also raises the stakes.

Foxconn Announces Q3 2026 Financial Results

11/12/2026 | Foxconn
Hon Hai Technology Group (Foxconn) announced its third quarter 2026 financial results. Revenue, gross profit, operating profit, and net profit for the third quarter and the first nine months of the year all reached record highs for the respective periods.

NOTE Secures SEK 80–100M Security and Defence Contract for 2027 Delivery

11/12/2026 | NOTE
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SpaceX Selects Qualcomm to Accelerate Starlink Mobile’s Nationwide 5G Network

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Nordson: Protecting Yield as Packaging Complexity Grows

11/12/2026 | Marcy LaRont, I-Connect007
As AI and high-performance computing push advanced packaging toward greater complexity, manufacturers must expand capacity while protecting yield on increasingly valuable assemblies. At SEMICON West, Nordson Electronic Solutions’ Jeanine Norlin, senior manager of marketing, and Liam Thorp, product line manager, discuss how the company is addressing those demands through plasma surface treatment and precision dispensing. They explain how plasma improves wettability and underfill flow, how the ASYMTEK Vantage XL handles large-panel warpage, and why coordinated process expertise across Nordson’s businesses is becoming more important for manufacturing reliability.
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