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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Indium Experts Investigate PCB Performance and Connectivity Solutions at SMTAI 2026

10/26/2026 | Indium Corporation
Five tech experts from Indium Corporation, a leading developer of AI-enabling and high-reliability soldering materials, will share new technical insights at SMTA International 2026, October 25–29, in Rosemont, Illinois.

Optimizing Mixed Alloy Solder Pastes for Low Voiding and High PCB Reliability

10/21/2026 | Thuy Nguyen, Hongwen Zhang, PhD, Ronald C. Lasky, PhD, and Adam Murling, Indium
Solder joint voiding remains a critical reliability concern in electronic packaging, particularly for high-performance and safety-critical applications such as automotive electronics. Excessive voiding can adversely affect both thermal conductivity and mechanical strength, leading to elevated junction temperatures, accelerated fatigue failure under thermal cycling, and ultimately reduce product lifetime.

Indium Halogen-Free Solder Paste Wins Mexico Technology Award

10/16/2026 | Indium Corporation
Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and electronics assembly, received a Mexico Technology Award in the solder paste category for its Indium12.9HF, a no-clean, halogen-free solder paste designed to meet the growing challenges of high-density, fine-pitch assemblies.

Indium Highlights Advanced Solder Solutions for Electronics Manufacturing at EFX 2026

09/29/2026 | Indium Corporation
As an industry leader in innovative materials solutions for electronics packaging, Indium Corporation® will showcase its high-reliability solder pastes for PCB assembly and automotive applications at Expo for Electronics Manufacturing (EFX) 2026, October 6-8, in Stuttgart, Germany.

Mexico Solders On With Indium Corporation

09/16/2026 | Nolan Johnson, SMT007 Magazine
It makes sense to go where the customers are, which is why Indium Corporation recently opened a new solder paste manufacturing facility in Guadalajara, Mexico. Chris Bastecki, vice president of the Americas Sales and Service Group at Indium Corporation, as well as vice president of PCB Assembly Materials, discusses the reasons behind the new facility, the growing market segments, and the challenges of matching solder to specific applications.
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