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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
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ESD Alliance Reports Electronic System Design Industry Posts $5.6 Billion in Revenue in Q3 2025
January 13, 2026 | SEMIEstimated reading time: 1 minute
Electronic System Design (ESD) industry revenue increased 8.8% to $5,566.4 million in the third quarter of 2025 from the $5,114.5 million registered in the third quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average rose 10.4%, based on a comparison of the most recent four quarters to the prior four.
“The electronic design automation (EDA) industry continues to report strong year-over-year revenue growth in Q3 2025,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “All product categories reported increases, with Semiconductor IP (SIP) and Services showing double digit gains. Geographic regions including Americas, EMEA, and APAC reported growth in Q3, with a double digit increase in APAC.”
The companies tracked in the EDMD report employed 73,185 people globally in Q3 2025, a 17.3% increase over the Q3 2024 headcount of 62,417 and up 0.9% compared to Q2 2025.
The quarterly EDMD report contains detailed revenue information within the following category and geographic breakdowns.
Revenue by Product and Application Category – Year-Over-Year Change
- Computer-Aided Engineering (CAE) revenue increased 9.1% to $2,097.8 million. The four-quarter CAE moving average increased 11.6%.
- IC Physical Design and Verification revenue increased 1.3% to $865.4 million. The four-quarter moving average for the category decreased 1.2%.
- Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue rose 3.4% to $466.2 million. The four-quarter moving average for PCB and MCM rose 8.1%.
- Semiconductor Intellectual Property (SIP) revenue increased 13.6% to $1,915.7 million. The four-quarter SIP moving average rose 14.8%.
- Services revenue increased 10.2% to $221.4 million. The four-quarter Services moving average rose 13.7%.
Revenue by Region – Year-Over-Year Change
- The Americas, the largest reporting region by revenue, procured $2,402.2 million of electronic system design products and services in Q3 2025, a 3.4% increase. The four-quarter moving average for the Americas rose 10.3%.
- Europe, Middle East, and Africa (EMEA) procured $675.1 million of electronic system design products and services in Q3 2025, a 4.6% increase. The four-quarter moving average for EMEA grew 7.6%.
- Japan’s procurement of electronic system design products and services decreased 11.5% to $264.0 million in Q3 2025. The four-quarter moving average for Japan increased 2.4%.
- Asia Pacific (APAC) procured $2,223.0 million of electronic system design products and services in Q3 2025, a 20.5% increase. The four-quarter moving average for APAC grew 12.8%.
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American Standard Circuits Manufactures IC Substrate Designs Featuring 5–7 Stacked Microvias
02/13/2026 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading U.S. manufacturer of advanced printed circuit board solutions, has successfully manufactured and shipped multiple IC substrate designs incorporating 5 to 7 stacked microvias using the company’s advanced Ultra High Density Interconnect (UHDI) manufacturing platform.
Astera Labs Opens Israel Design Center to Boost AI Connectivity Expansion
02/13/2026 | Astera Labs, Inc.Astera Labs, Inc., a leader in semiconductor-based connectivity solutions for rack-scale AI infrastructure, announced a significant expansion of its global engineering operations with the establishment of an advanced research and development center in Israel.
EIPC Winter Conference Review: From Innovation to Qualification
02/13/2026 | Pete Starkey, I-Connect007Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/13/2026 | Michelle Te, I-Connect007This week, I’ve taken some extra time to better learn some video and photo editing software programs we use at I-Connect007. You’ll want to check out my LinkedIn video to see how I brought my avatar to life for this week’s must-reads! The items I’m highlighting this week are also about learning something new, from Pete Starkey’s thorough three-day review of the EIPC Winter Conference in Aix-en-Provence, France, to what’s on the horizon for advanced electronics packaging. I also share details about the new Design Village at APEX EXPO 2026, preview a new column from Remtec’s Chandra Gupta, and discuss why marketing isn’t a one-and-done deal.
Proper Plane Design Techniques
02/12/2026 | I-Connect007 Editorial TeamContinuing our discussion from the November issue of Design007 Magazine on proper plane design, Kris Moyer, an instructor for the Global Electronics Association, shares techniques he teaches his PCB design students to use. When it comes to plane design, there are several challenges with modern high-speed designs. Planes, or more specifically, mirror/return paths, are critical to proper controlled impedance transmission line design. Additionally, to mitigate high-speed switching “noise,” the use of planar capacitance is now necessary and critical.