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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
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Siemens Acquires ASTER Technologies to Deliver Industry-leading PCB Test Engineering Solutions
January 14, 2026 | PRNewswireEstimated reading time: 3 minutes
Siemens announced it has acquired ASTER Technologies ("ASTER"), a privately held market leader in printed circuit board assembly (PCBA) test verification and engineering software. This strategic move integrates ASTER's advanced "shift-left" design for test (DFT) functionality directly into Siemens' Xpedition™ software and Valor™ software – part of the Siemens Xcelerator portfolio of industry software – establishing an unparalleled, comprehensive portfolio for electronic systems design. The acquisition empowers customers with a truly integrated digital thread from PCB design engineering to manufacturing, enabling earlier defect detection, reduced costs, accelerated time-to-market and improved product quality and reliability.
Addressing growing complexity in electronics
The acquisition comes at a critical time, as the accelerating demand for automotive electronics and the increased integration of 5G technology in electronics systems necessitate robust testing solutions to help to ensure safety, reliability and compliance with stringent standards. A comprehensive test engineering strategy is paramount to intercepting defects, avoiding costly design re-spins, preventing product returns, and reducing field failures. Organizations are increasingly seeking DFT functionality embedded within their PCB design solutions and an integrated workflow for PCB design.
ASTER's expertise enhances Siemens' Design for Manufacturing (DFM) offering
Founded in 1993, and based in Cesson-Sévigné, France, ASTER has established itself as a leading supplier of software tools for verifying, assembling and testing PCB assemblies for over 30 years. The company provides compelling DFM physical design verification software solutions for PCB fabrication, assembly and test, alongside robust test coverage analysis and optimized test programming capabilities. Its flagship product, TestWay, is renowned for its best-in-class DFT planning and implementation, enabling companies to prepare designs and implement robust test strategies early in the PCB assembly manufacturing process. TestWay complements Siemens' Valor design for fabrication and assembly capabilities, creating a comprehensive DFM solution.
"The addition of ASTER Technologies is a game-changer for our customers in the PCB design and manufacturing space. By integrating ASTER's market-leading test engineering software, we are empowering our customers to optimize designs much earlier in the design cycle," said AJ Incorvaia, senior vice president and general manager, electronic board systems at Siemens Digital Industries Software. "This can dramatically reduce costs, accelerate time-to-market and helps to ensure the highest levels of product quality and reliability. It's about giving our customers a complete, integrated solution that sets them up for success from the very first design concept through final production."
Strategic fit for complex electronic systems
ASTER's solutions are primarily used in sophisticated, high-end designs across computing/HPC, automotive and networking sectors, where developing efficient and cost-productive test strategies is crucial. This acquisition allows Siemens to expand its differentiated and comprehensive DFM solution for the global PCB market.
"Joining forces with Siemens is an incredibly exciting next chapter for our team and our customers. We've always been passionate about helping engineers create flawless PCB designs through advanced test coverage analysis," said Christophe Lotz, founder and chief executive officer, ASTER Technologies. "Now, as part of Siemens, we have an unparalleled opportunity to integrate our expertise into a broader, industry-leading portfolio. This means our innovative solutions can reach more customers, enabling them to achieve even greater efficiency, quality and competitive advantage. We are thrilled to contribute to Siemens' vision of a truly integrated digital thread for electronics design and manufacturing with just enough test."
Expanding Siemens' EDA portfolio
With this acquisition, Siemens continues to provide customers with the best-in-class electronic system design technology they need to design the greatest products and build them efficiently and with high quality. The integration of ASTER's technology will embed manufacturing capabilities within the PCBA design portfolio, expanding the Siemens Xcelerator portfolio and creating a significant competitive edge. This move allows Siemens to offer a full spectrum of DFM capabilities, helping customers to ensure designs not only meet manufacturing requirements but also proactively optimize test strategies from the earliest stages of development.
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Rachael Temple - AlltematedSuggested Items
American Standard Circuits Manufactures IC Substrate Designs Featuring 5–7 Stacked Microvias
02/13/2026 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading U.S. manufacturer of advanced printed circuit board solutions, has successfully manufactured and shipped multiple IC substrate designs incorporating 5 to 7 stacked microvias using the company’s advanced Ultra High Density Interconnect (UHDI) manufacturing platform.
Astera Labs Opens Israel Design Center to Boost AI Connectivity Expansion
02/13/2026 | Astera Labs, Inc.Astera Labs, Inc., a leader in semiconductor-based connectivity solutions for rack-scale AI infrastructure, announced a significant expansion of its global engineering operations with the establishment of an advanced research and development center in Israel.
EIPC Winter Conference Review: From Innovation to Qualification
02/13/2026 | Pete Starkey, I-Connect007Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/13/2026 | Michelle Te, I-Connect007This week, I’ve taken some extra time to better learn some video and photo editing software programs we use at I-Connect007. You’ll want to check out my LinkedIn video to see how I brought my avatar to life for this week’s must-reads! The items I’m highlighting this week are also about learning something new, from Pete Starkey’s thorough three-day review of the EIPC Winter Conference in Aix-en-Provence, France, to what’s on the horizon for advanced electronics packaging. I also share details about the new Design Village at APEX EXPO 2026, preview a new column from Remtec’s Chandra Gupta, and discuss why marketing isn’t a one-and-done deal.
Proper Plane Design Techniques
02/12/2026 | I-Connect007 Editorial TeamContinuing our discussion from the November issue of Design007 Magazine on proper plane design, Kris Moyer, an instructor for the Global Electronics Association, shares techniques he teaches his PCB design students to use. When it comes to plane design, there are several challenges with modern high-speed designs. Planes, or more specifically, mirror/return paths, are critical to proper controlled impedance transmission line design. Additionally, to mitigate high-speed switching “noise,” the use of planar capacitance is now necessary and critical.