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Indium Corporation® will feature its formic acid soldering technologies (FAST) product series at NEPCON Japan 2026, taking place January 21-23, in Tokyo.
The company will feature various solutions ideal for power device packaging, ranging from pastes, solders, and tracking agents.
- InFORMS® are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications.
- Indalloy®301LT for Preforms/InFORMS® is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
- AuLTRA® ThInFORMS® are 0.00035-inch-thick (0.00889mm, or 8.89μm) 80Au/20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA® ThInFORMS® help combat common issues such as shorting and poor thermal transfer.
Learn more about FAST solutions at the Indium Corporation website and visit our experts at NEPCON Japan 2026, booth #E1-36.
