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Announcing the New, Integrated I-Connect007 Magazine
January 20, 2026 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Design and fabrication have always been closely connected, but the rising demands for reliability, performance, and cost efficiency now require a closer alignment than ever before.
To that end, we are excited to launch I-Connect007 Magazine, which brings our Design007 Magazine and PCB007 Magazine under a single title. This evolution enables us to present a more comprehensive view of the PCB and interconnect lifecycle while maintaining the depth, technical rigor, and practical focus that you expect.
So, what’s in this issue? This month, we asked designers, fabricators, and suppliers what they see for 2026 and beyond and you’re likely to see your own thoughts reflected in their commentary. On the design side, you’ll find articles ranging from the greatest challenges to PCB designers to technical topics on 3D design and pattern plating, optimization to the IPC-2152 specification, and the evolution of flexible circuits. We also give you a preview of the Design Village at APEX EXPO.
In PCB fabrication, fabricators and suppliers also look ahead at the challenges of adapting to changes we cannot yet see whether that’s in additive manufacturing technology, building machines for the next phase of technology, or where PCB fabrication will lead in Europe.
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Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
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