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Lam Research Expands Boise Investment to Support U.S. Chip Growth

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In a ribbon-cutting ceremony, Lam Research Corp. commemorated the opening of its new office in Boise, Idaho, joined by U.S. Senator Jim Risch, representatives of Micron Technology, Inc. and other distinguished local government, community, and academic leaders.

EIPC Winter Conference Review: From Innovation to Qualification

02/13/2026 | Pete Starkey, I-Connect007
Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”

Micron Breaks Ground on Advanced Wafer Fabrication Facility in Singapore

01/27/2026 | Micron
Micron Technology, Inc. broke ground on an advanced wafer fabrication facility located within the company's existing NAND manufacturing complex in Singapore.

Micron’s Acquisition of PSMC’s Tongluo Fab Could Lift Global DRAM Supply Outlook in 2027

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TrendForce’s latest DRAM industry survey reveals that Micron intends to acquire PSMC’s Tongluo fab in Taiwan (excluding production equipment) for US$1.8 billion.

Micron Announces Groundbreaking for Historic New York Megafab

01/13/2026 | Micron
Micron Technology, Inc. announced that on Jan. 16, 2026, it will officially break ground on its megafab in Onondaga County, New York.
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