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KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (IMAPS) Wire Bonding 2026 Workshop and Tabletop Exhibition, scheduled to take place May 12-13 at the Crowne Plaza Boston-Woburn in Woburn, MA. The KYZEN clean team will be on-site to showcase multi-process power module cleaner MICRONOX MX2123 during the event.
With the continued rise in demand for high-performance advanced packaging devices, KYZEN remains dedicated to providing cleaning chemistries like MICRONOX MX2123 and process optimization services to meet the array of challenges faced by manufacturers.
MICRONOX MX2123 is a balanced, multi-phase chemistry designed to remove flux residues from a wide range of IGBT module devices that utilize combinations of copper, silver and nickel DBC as substrates. It can also remove fluxes from PCBs. MX2123 can remove slight metal oxidation from base metals for post wire bond and potting processes, leaving exceptional surface conditions after cleaning. It is effective at low temperatures, in low concentrations, and is easily monitored in in-line SIA or Ultrasonic Immersion cleaning systems.
The IMAPS Wire Bonding 2026 Workshop and Tabletop Exhibition is an advanced technical workshop presenting a unique forum to unite scientists, engineers, manufacturing, academia and others working in Wire Bonding. The workshop was established to provide a platform for presentations and debate regarding the latest technologies and applications of Wire Bonding use in battery pack, semiconductor, and microelectronic packaging.
