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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Applied Materials, UCLA Accelerate Semiconductor Innovation at EPIC Center

10/09/2026 | Globe Newswire
Applied Materials, Inc. announced that the UCLA Samueli School of Engineering will join the company’s EPIC Center in Silicon Valley as a research partner.

Applied Materials, Intel Collaborate on AI Chipmaking Innovations

10/08/2026 | Globe Newswire
Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, announced it is working with Intel Corporation to accelerate development of chipmaking innovations for next-generation transistors, interconnects and advanced packaging technologies.

Applied Materials, Besi Expand Strategic Partnership

10/02/2026 | Applied Materials
Applied Materials, Inc. and BE Semiconductor Industries N.V. (Besi) announced an expansion of their longstanding strategic partnership, with Besi joining Applied's EPIC Center as an Innovation Partner.

Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips

07/02/2026 | Applied Materials
Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, introduced a suite of new chipmaking systems for building the advanced 3D chip architectures that power next-generation AI.

Applied Materials Expands Singapore Manufacturing to Support AI Chip Demand

06/11/2026 | Applied Materials
Applied Materials, Inc., the leader in materials engineering solutions for the semiconductor industry, has expanded its manufacturing and R&D operations in Singapore to support the global build-out of AI infrastructure.
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