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Advanced Electronics Packaging Digest

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KONGSBERG to Build Polish Plant for Counter-Drone Systems

10/13/2026 | KONGSBERG
Kongsberg Gruppen ASA (KONGSBERG) is establishing a new manufacturing facility for sustainment and manufacturing of Counter-Unmanned Aerial Systems (CUAS) systems in Poland.

eInfochips Showcases End-to-End ASIC Design Capabilities

10/13/2026 | PRNewswire
eInfochips, an Arrow Electronics company and provider of semiconductor and product engineering services, announced that it has successfully demonstrated end-to-end turnkey ASICdesign capability through the development, fabrication, packaging, and bring-up of a test chip.

Global 300mm Fab Equipment Spending to Reach $227 Billion in 2029 as Buildout Accelerates

10/13/2026 | SEMI
Global 300mm front-end fab equipment spending is projected to reach $149 billion in 2026, up 31% year-over-year, SEMI reported today in its latest 300mm Fab Outlook. Investment is expected to continue growing at double-digit rates through 2029, reaching $227 billion.

KAGA Electronics Signs Contract Manufacturing Agreement with Star seeds for AI Servers

10/13/2026 | KAGA ELECTRONICS
KAGA ELECTRONICS CO., LTD. hereby announces that it has entered into a basic agreement with Star seeds Co., Ltd., an AI infrastructure provider offering end-to-end solutions entirely within Japan, from GPU procurement to AI data center construction and operation.

Jaltek Achieves Nadcap Accreditation Following Norautron Acquisition

10/13/2026 | Jaltek
Luton-based electronics design and manufacturing specialist Jaltek, recently acquired by Norautron AS, an international provider of advanced electronics manufacturing services, has achieved Nadcap accreditation.
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