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Martin Hart, CEO of TopLine Corporation, will present “Reliability of Cu-Wrap and Braided Column CGAs for Extreme Cold Applications” at the upcoming Pan Pacific Strategic Electronics Symposium, February 2-5, 2026, at The Hapuna Westin Resort, Big Island, Hawaii, USA.
Hart is presenting a technical paper that is co-authored with Reza Ghaffarian of JPL NASA. This paper documents the findings of the accelerated thermal cycle testing done on TopLine braided columns. The topic addresses column reliability in extremely cold environments.
Acording to Hart, “Braided Solder Columns can withstand the rigors of deep space cold and cryogenic environments and represent a robust new solution to challenges facing next generation large packages in electronics assembly.”
