-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
- Articles
Article Highlights
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
What’s Next for Global Electronics: A 2026 Outlook from East Asia
January 23, 2026 | Sydney Xiao, Global Electronics Association East AsiaEstimated reading time: 1 minute
This is the latest entry in our ongoing blog series, where Global Electronics Association experts explore the forces shaping the future of the global electronics industry.
Today, we turn to insights from Sydney Xiao, President of the East Asia Region, who provides her predictions below.
RATIONALIZED INVESTMENT: Investment in 2026 is expected to become more disciplined, with companies placing greater emphasis on sustainable returns rather than aggressive expansion. This shift may help differentiate organizations with resilient, long-term business models from those driven primarily by short-term momentum.
AI CONVERGENCE ACROSS SECTORS: AI is evolving into a core capability across many product categories, supported by continued growth in edge AI chips. Automotive, industrial, and telecom systems are likely to further integrate AI functionalities, creating demand for more specialized processors and intelligent components.
ADVANCED SEMICONDUCTOR DEMAND: Demand for power semiconductors is expected to rise as EV and Advanced Driver Assistance Systems (ADAS) adoption continues to broaden. At the same time, increasing regional investment in advanced packaging technologies, including 2.5D and 3D ICs, is expected to further support the development of next-generation automotive and edge AI devices.
SECURITY AS A STRATEGIC FOUNDATION: Security across supply chains, product design, and data is likely to become a more central strategic priority. Regional cooperation may expand under clearer “secure and trusted” frameworks as governments seek to enhance predictability, transparency, and resilience through policy and incentive structures.
NEARSHORING AND FOOTPRINT OPTIMIZATION: Nearshoring is expected to play an increasingly important role in manufacturing strategies. While it often involves a higher upfront investment, it can help mitigate disruption risks, shorten supply cycles, and facilitate greater automation. When evaluated through total cost of ownership, nearshoring may emerge as a more competitive and strategically attractive option over time.
Looking Ahead
Companies that integrate AI capability, advanced semiconductor technologies, secure supply chains, and optimized manufacturing footprints will be better positioned to navigate volatility and capture sustainable growth in 2026 and the years ahead.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
01/30/2026 | Marcy LaRont, I-Connect007It’s the last week of January, and it’s been pretty cold outside. That’s the best time to hunker down and catch up on your reading. Here are my top five must-reads for this week. All eyes continue to be on advanced electronics processes and packaging technology, which are highlighted in Pete Starkey’s review of the ICT winter conference in the UK, as well as Nolan Johnson’s article on inflection points, and Kris Moyer’s look forward into what will be important for PCB designers in 2026 and beyond. Candor Industries’ Sunny Patel discusses “Normalizing the Impossible” in his look forward, and Mike Jouppi contributes with his critical look at what IPC-2152 does not cover.
Beyond IPC-2152: Creating Technology-specific Current-carrying Capacity Design Charts Using Thermal Modeling
01/29/2026 | Mike Jouppi, Thermal Management LLCDesigners commonly size traces using online calculators based on IPC-2221 or IPC-2152 charts, selecting width and thickness for a given current and allowable temperature rise (ΔT). Consideration is given to parallel conductors, although this is not a practical evaluation method for most designs. An important aspect of trace heating, especially groups of traces, is the power dissipated by the conductors. Unfortunately, the power dissipation or a method for accounting for power losses in the traces/conductors or planes is not straightforward.
India’s Electronics Manufacturing Ecosystem Gears Up for IEMI 2026
01/27/2026 | Global Electronics AssociationIndia continues its acceleration as a global electronics manufacturing hub. At the heart of this momentum is Integrated Electronics Manufacturing & Interconnections (IEMI) 2026, the flagship industry platform of the Global Electronics Association.
Global Electronics Association Appoints Raj Tiwari as Country Manager to Advance Thailand’s Electronics Manufacturing Ecosystem
01/26/2026 | Global Electronics AssociationThailand continues to be one of Southeast Asia’s most important electronics manufacturing hubs, with strong capabilities across automotive electronics, industrial electronics, electrical equipment, and high-reliability manufacturing.
New IPC-6921 Standard Sets Requirements and Acceptance Criteria for Organic IC Substrates
01/23/2026 | Global Electronics AssociationThe Global Electronics Association has officially released IPC-6921, Requirements and Acceptance for Organic IC Substrates.