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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/30/2026 | Marcy LaRont, I-Connect007
It’s the last week of January, and it’s been pretty cold outside. That’s the best time to hunker down and catch up on your reading. Here are my top five must-reads for this week. All eyes continue to be on advanced electronics processes and packaging technology, which are highlighted in Pete Starkey’s review of the ICT winter conference in the UK, as well as Nolan Johnson’s article on inflection points, and Kris Moyer’s look forward into what will be important for PCB designers in 2026 and beyond. Candor Industries’ Sunny Patel discusses “Normalizing the Impossible” in his look forward, and Mike Jouppi contributes with his critical look at what IPC-2152 does not cover.

Beyond IPC-2152: Creating Technology-specific Current-carrying Capacity Design Charts Using Thermal Modeling

01/29/2026 | Mike Jouppi, Thermal Management LLC
Designers commonly size traces using online calculators based on IPC-2221 or IPC-2152 charts, selecting width and thickness for a given current and allowable temperature rise (ΔT). Consideration is given to parallel conductors, although this is not a practical evaluation method for most designs. An important aspect of trace heating, especially groups of traces, is the power dissipated by the conductors. Unfortunately, the power dissipation or a method for accounting for power losses in the traces/conductors or planes is not straightforward.

India’s Electronics Manufacturing Ecosystem Gears Up for IEMI 2026

01/27/2026 | Global Electronics Association
India continues its acceleration as a global electronics manufacturing hub. At the heart of this momentum is Integrated Electronics Manufacturing & Interconnections (IEMI) 2026, the flagship industry platform of the Global Electronics Association.

Global Electronics Association Appoints Raj Tiwari as Country Manager to Advance Thailand’s Electronics Manufacturing Ecosystem

01/26/2026 | Global Electronics Association
Thailand continues to be one of Southeast Asia’s most important electronics manufacturing hubs, with strong capabilities across automotive electronics, industrial electronics, electrical equipment, and high-reliability manufacturing.

New IPC-6921 Standard Sets Requirements and Acceptance Criteria for Organic IC Substrates

01/23/2026 | Global Electronics Association
The Global Electronics Association has officially released IPC-6921, Requirements and Acceptance for Organic IC Substrates.
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