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Collaboration between OEM and EMS to Combat Head-on-Pillowing Defects (Part 2)

08/28/2015 | I-Connect007
There have been many publications, industry workshops, and symposia that describe process mitigation techniques for minimizing the occurrence of head-on-pillow defects during surface mount assembly. In this article, the authors address the root cause of the HoP defect—specifically the link between HoP defects and component warpage.
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