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How Technology, Materials, and Manufacturing Will Redefine 2026
January 28, 2026 | Matt Kelly, Global Electronics AssociationEstimated reading time: 1 minute
Matt Kelly, chief technology officer and vice president of standards and technology for the Global Electronics Association, explores how technology, supply chains, sustainability, and standards are redefining the electronics ecosystem. This is the latest installment in a blog series exploring the future of the global electronics industry.
Global Electronics Ecosystem
Electronics continues to infiltrate every industry as automotive, aerospace, defense, and energy sectors become compute-intensive. The electronics ecosystem will expand far beyond traditional boundaries. Next-generation semiconductors and advanced packaging architectures are the central nervous system of modern vehicles, aircraft, and infrastructure.
Supply Chain
Single-region dependency becomes unacceptable. Companies will build multi-regional, multi-tier resilience with unprecedented visibility into second and third-tier suppliers. The new competitive advantage isn't just efficiency; it's redundancy and agility across supplier networks.
Sustainability
Critical materials recovery will shift from pilot projects to an industrial scale. As supply pressures intensify, electronics manufacturers will invest heavily in reclaiming rare earths, critical metals, and substrates, turning end-of-life products into strategic reserves against future shortages.
Materials
Advanced packaging is the new frontier, and it demands new materials. Growth in 3D stacking, chiplets, and photonics will drive rapid innovation in advanced dielectrics, substrates, and photonic technologies. Material science is as critical as semiconductor design.
Manufacturing
Smart manufacturing goes mainstream. Digital twins, autonomous process control, and AI/ML optimization will continue to transform production floors, boosting yield, speed, and agility while separating industry leaders from those stuck in legacy operations.
Artificial Intelligence Infrastructure and Data Centers
AI workloads will reshape the entire electronics stack, driving demand for next-gen semiconductor nodes, advanced 3D packaging, chiplets, and high-bandwidth memory. Meanwhile, AI-HPC's escalating power and thermal demands will force data center reinvention: liquid cooling goes mainstream, power delivery gets reimagined, and site geography shifts as operators chase locations with abundant energy and cooling capacity at economically viable costs.
Looking Ahead
Success in the electronics industry will depend on systems thinking. Companies will need to align their technology roadmaps, innovate with materials, enhance manufacturing intelligence, and develop new guidelines and standards across a significantly expanded ecosystem. As AI, sustainability, and resilience come together, those businesses that invest early in interoperable technologies and globally coordinated supply networks will help establish the guidelines for the next era of electronics.
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Julia McCaffrey - NCAB GroupSuggested Items
TFE Marks 25 Years Supporting PCB and Industrial Manufacturing
01/30/2026 | TFET. Friedl Enterprises (TFE) marks its 25th year supporting the PCB electronics and industrial manufacturing sectors with technical solutions, materials, and equipment across North America.
TSTRONIC Launches Expert Knowledge Hub for Electronics Manufacturing
01/30/2026 | TSTRONICTSTRONIC, a leading provider of electronic manufacturing services (EMS), announced the launch of its EMS Expert Knowledge Center, a comprehensive online resource dedicated to advancing technical expertise in electronics manufacturing.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
01/30/2026 | Marcy LaRont, I-Connect007It’s the last week of January, and it’s been pretty cold outside. That’s the best time to hunker down and catch up on your reading. Here are my top five must-reads for this week. All eyes continue to be on advanced electronics processes and packaging technology, which are highlighted in Pete Starkey’s review of the ICT winter conference in the UK, as well as Nolan Johnson’s article on inflection points, and Kris Moyer’s look forward into what will be important for PCB designers in 2026 and beyond. Candor Industries’ Sunny Patel discusses “Normalizing the Impossible” in his look forward, and Mike Jouppi contributes with his critical look at what IPC-2152 does not cover.
Zollner Establishes Shared Service Center in Pune, India
01/30/2026 | Zollner Elektronik AGWe are consistently continuing our internationalization strategy and are establishing a Shared Service Center in Pune, India. The new location will operate under the name Zollner Services India Pvt. Ltd. and is currently in the founding phase.
GPV Takes Part in DDAC 2026 to Support Defence and Security Collaboration
01/30/2026 | GPVGPV is pleased to take part in this year’s Danish Defence Annual Conference 2026 (DDAC 2026) on 5-6 February, hosted by DI Forsvar og sikkerhed, where GPV is also a member.